Laser-Induced Polymer Deposition for Uniform Substrate Processing
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Solution Overview
Problem
Current substrate processing devices face challenges in achieving reliable and efficient vapor deposition of polymers on substrates, particularly in semiconductor manufacturing, where precise control over deposition processes is crucial to prevent particle generation and by-product formation.
Innovation Solution
A substrate processing device is designed with a substrate support, fluid supply system for initiating and monomer injection, and a laser generation component that intersects and polymerizes the initiator and monomer, ensuring uniform deposition on the substrate, enhancing vapor deposition performance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vapor deposition methods are used, then polymer deposition can be achieved, but particle generation and by-product formation occur reducing reliability
Solution Approach 1:
The patent changes the fundamental parameter of the deposition method from conventional thermal or chemical vapor deposition to laser-induced polymerization. This parameter change enables direct polymerization of monomer vapor on the substrate surface, eliminating the intermediate steps that generate particles and by-products, thereby improving deposition reliability
Solution Approach 2:
The patent replaces conventional thermal field-based vapor deposition with a laser-induced photopolymerization mechanism. The laser provides localized energy for polymerization without the need for high-temperature thermal fields, reducing harmful by-products and improving reliability
2Manufacturing precision
If laser irradiation is applied to polymerize initiator and monomer, then deposition uniformity improves, but system complexity increases
Solution Approach 1:
The patent combines the laser irradiation system with the existing vapor supply system, where the laser beam is directed through or alongside the monomer delivery path. This merging allows the laser to simultaneously polymerize monomer molecules as they are supplied, achieving uniform deposition without requiring separate complex processing chambers
Solution Approach 2:
The patent introduces an initiator substance as an intermediary that facilitates polymerization when exposed to laser radiation. The initiator absorbs laser energy and triggers polymerization of monomer molecules, enabling controlled and uniform deposition while simplifying the overall system design compared to direct high-power laser polymerization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device improves the uniformity and reliability of polymer deposition on substrates, reducing particle generation and by-products, thereby enhancing the precision and efficiency of semiconductor manufacturing processes.
Implementation Method 1
a laser generation portion configured to irradiate a laser in a direction intersecting a direction in which the initiator and the monomer are supplied, and parallel to a surface of the substrate, wherein the initiator and the monomer are polymerized by the laser and deposited on the substrate
Data Source
AI summary
A substrate processing device includes a substrate support portion supporting a substrate, a fluid supply portion arranged above the substrate support portion and configured to supply an initiator and a monomer toward the substrate, and a laser generation portion configured to irradiate a laser in a direction intersecting a direction in which the initiator and the monomer are supplied and parallel to a surface of the substrate, wherein the initiator and the monomer are polymerized by the laser and deposited on the substrate.