Gas-Pressurized Laser Pressure Head for Uniform Large-Area Bonding

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Solution Overview

Problem

Thermal deformation of pressure members in laser bonding processes leads to non-uniform pressing forces and alignment issues during the bonding of semiconductor devices to substrates, especially in large-sized displays, affecting productivity and reliability.

Innovation Solution

A laser pressure head module with a dual light-transmitting member structure, including a rigid and an elastic member, and a sealed space filled with gas to generate a uniform pressing force, allowing for uniform bonding of substrates and semiconductor devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the area of the pressure member is increased to cover large-sized substrates, then the coverage area is improved, but it becomes more difficult to maintain flatness and parallelism

Engineering Contradiction:
Improvepressure member areaVSAvoidflatness and parallelism
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The pressure member is divided into multiple independent pressing units, each capable of independent pressure application. This segmentation allows each unit to maintain flatness and parallelism independently, solving the difficulty of maintaining precision across large areas while still providing comprehensive coverage through the collective action of multiple units.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each pressing unit is designed with localized pressing capabilities, allowing different regions of the pressure member to apply pressure independently. This enables precise control of flatness and parallelism in each local area, while the overall system covers large substrate areas through the coordination of multiple localized units.

Inventive Principle:
Principle #3Local quality

2Reliability

If heat is applied to the pressure member during laser bonding, then the bonding process is enabled, but thermal deformation occurs causing non-contact and alignment distortion

Engineering Contradiction:
Improvebonding processVSAvoidpressure member stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

A heat-resistant intermediary material is introduced between the pressure member and the substrate to isolate the pressure member from direct heat exposure. This intermediary layer allows heat to be transferred to the substrate for bonding while preventing thermal deformation of the pressure member, maintaining both bonding reliability and pressure member stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The pressure member is designed with materials and structural parameters that resist thermal deformation. By changing the material properties and structural parameters to be heat-resistant, the pressure member can withstand the thermal environment during laser bonding without deforming, thereby maintaining both bonding effectiveness and dimensional stability.

Inventive Principle:
Principle #35Parameter changes

3Area of stationary object

If a single pressure member is used for large area bonding, then coverage is improved, but uniform pressing force becomes difficult to maintain

Engineering Contradiction:
Improvebonding areaVSAvoidpressing force uniformity
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The pressure member is segmented into multiple independent pressing units that can be controlled separately. This allows uniform pressing force to be maintained across large areas by independently adjusting each unit, preventing the force non-uniformity that would occur with a single large pressure member.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The pressing units are designed with dynamic control capabilities, allowing real-time adjustment of pressing force distribution. This dynamic control enables uniform pressing force to be maintained across large bonding areas, adapting to variations in substrate characteristics and ensuring consistent bonding quality throughout the entire area.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures uniform pressurization across large areas without deformation, enhancing the bonding process's reliability and productivity by maintaining alignment and flatness.

Implementation Method 1

a gas supply unit configured to supply gas to the sealed space to generate a pressing force

Methodology Applied
Scientific EffectGas pressure: Pressure Increase

Implementation Method 2

The second light-transmitting member is configured to be expanded or moved in an external direction by the pressing force

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS12557582B2Laser pressure head module and laser bonding apparatus including the same
Publication Date: 2026.02.17 SAMSUNG DISPLAY CO LTD
  • US12557582B2 patent drawing
  • US12557582B2 patent drawing
  • US12557582B2 patent drawing

AI summary

A laser pressure head module including: a pressure member including: a first light-transmitting member; a second light-transmitting member; and a sealed space between the first light-transmitting member and the second light-transmitting member; and a gas supply unit to supply gas to the sealed space to generate a pressing force. The second light-transmitting member is to be expanded or moved in an external direction by the pressing force.