Semiconductor Laser Probe Cooling for Stable Inspection Contact
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Solution Overview
Problem
The challenge is to prevent the characteristics of a semiconductor laser device from varying when contacted with a probe, due to the lack of space for a Peltier element and insufficient cooling, leading to measurement variance and instability.
Innovation Solution
A semiconductor laser inspection apparatus is designed with a first heating-cooling device for the semiconductor laser device and a second heating-cooling device with a probe holder, allowing the measurement probe to be cooled and temperature-controlled, thereby maintaining stability and consistency in measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a Peltier element is installed on the probe to cool it, then the probe temperature can be controlled, but the probe size becomes too large to fit in the available space
Solution Approach 1:
The cooling function is extracted from the probe itself and relocated to a separate cooling device positioned near the probe. The cooling device includes a cooling blade that contacts the probe to transfer cooling effect, allowing the probe to remain small while still achieving temperature control through the external cooling system.
Solution Approach 2:
A cooling blade acts as an intermediary between the cooling device and the probe. The cooling blade transfers the cooling effect from the cooling device to the probe without requiring the Peltier element to be integrated into the probe structure, thus maintaining probe compactness while achieving cooling functionality.
2Temperature
If water cooling is implemented through a small hole in the support component, then the structure remains compact, but sufficient cooling cannot be achieved
Solution Approach 1:
The cooling function is extracted from the support component's internal water cooling system and implemented through a separate cooling device with a cooling blade. This allows the support component to maintain its compact structure with small holes while the dedicated cooling device provides sufficient cooling capacity through direct contact with the probe.
Solution Approach 2:
The cooling device uses hydraulic cooling with cooling water flowing through channels in the cooling blade. This allows efficient heat transfer from the probe to the cooling water, achieving sufficient cooling effectiveness without requiring large cooling holes in the support component.
3Temperature
If the probe is cooled using a separate cooling device, then the probe can be cooled effectively, but the device complexity increases
Solution Approach 1:
The cooling device is designed to perform multiple functions: it cools the probe through the cooling blade, provides structural support, and can be integrated with the existing heating-cooling device for the semiconductor laser device. This multi-functionality reduces overall system complexity despite adding a cooling component.
Solution Approach 2:
The cooling device is positioned and integrated near the heating-cooling device, allowing both devices to work in coordination. The fine movement table controls both the heating-cooling device and the cooling device together, merging their control functions and reducing operational complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures that the temperature of the semiconductor laser device and the measurement probe are closely matched, preventing characteristic variations and reducing measurement variance, thus stabilizing the inspection process.
Implementation Method 1
a first heating-cooling device (1) on which a semiconductor laser device (2) is placed; a second heating-cooling device (3);
Implementation Method 2
To cool a probe, a Peltier element needs to be installed on the probe
Data Source
AI summary
A semiconductor laser device (2) is placed on a first heating-cooling device (1). A probe holder (4) is attached on a second heating-cooling device (3). A measurement probe (8) is fixed to a distal end of the probe holder (4). A fine movement table (9) moves the second heating-cooling device (3) and the probe holder (4) so that a distal end of the measurement probe (8) contacts the semiconductor laser device (2). An inspection apparatus (10) inputs an inspection signal to the semiconductor laser device (2) through the measurement probe (8).