Laser-Processed Insulating Gap for Chip Contacting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for contacting chips with conductor terminal faces in RFID technology face challenges in achieving accurate positioning due to irregular contours of the conductor terminal faces produced by etching, which limits the miniaturization of the insulating gap, making it difficult to accommodate smaller chips with tighter positioning tolerances.
Innovation Solution
The method involves forming an insulating gap by removing the conductor material layer using a laser, allowing for a precise and regular contour, reducing the required positioning accuracy and enabling the use of less expensive materials like aluminum for the conductor material layer, while also allowing for the application of adhesive materials and image processing for precise chip placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If etching process is used to produce conductor terminal faces, then conductor arrangement can be formed, but the contour becomes irregular which worsens positioning accuracy
Solution Approach 1:
The patent replaces the mechanical/chemical etching process with a laser-based system to produce the insulating gap. The laser beam precisely removes conductor material layer to create a regular-contoured insulating gap, eliminating the irregular contours caused by etching while maintaining ease of manufacture through automated laser processing.
Solution Approach 2:
The patent changes the method of creating the insulating gap from chemical etching to thermal/laser ablation. This parameter change in the manufacturing process enables precise control of the insulating gap dimensions and contour regularity, directly improving chip positioning accuracy without sacrificing manufacturing capability.
2Length of moving object
If insulating gap width is reduced to accommodate smaller chips, then chip size can be minimized, but positioning tolerance becomes too tight to achieve
Solution Approach 1:
By replacing etching with laser processing, the patent achieves superior dimensional control and contour regularity in the insulating gap. This enables the use of smaller insulating gap widths (e.g., 20-50 μm) while maintaining achievable positioning tolerances, as the laser creates perfectly defined edges that eliminate the irregularities that would otherwise require larger safety margins.
3Manufacturing precision
If copper is used for conductor material layer to achieve regular contour, then positioning accuracy improves, but production cost increases
Solution Approach 1:
The patent replaces the need for expensive copper materials with a process-based solution. By using laser processing to create the insulating gap, regular contours are achieved through precise laser beam control rather than through material selection, allowing the use of cost-effective aluminum or other conductive materials in mass production while maintaining positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the positioning tolerance requirements, lowers assembly costs, and enables the production of conductor arrangements suitable for smaller chips by creating a precise insulating gap, facilitating the use of less expensive materials and improving the accuracy of chip placement.
Implementation Method 1
an insulating gap is formed by removal of the conductor material layer by means of a laser
Data Source
AI summary
The invention relates to a method for contacting a chip with a conductor arrangement and also to a conductor arrangement, particularly a transponder antenna, an intermediate carrier or the like, with a carrier substrate (55) for accommodating the chip and with a chip having chip terminal faces formed thereon, wherein a conductor material layer (66) is formed on the carrier substrate, wherein the conductor material layer forms a conductor arrangement (64) having at least two conductors (56, 57) which are connected to each other in a chip contact area (58), wherein an insulating gap (59) is formed in the chip contact area, such that mutually electrically insulated conductor terminal faces (60, 61) of the conductors are formed, wherein the chip terminal faces are contacted with the conductor terminal faces, and wherein the insulating gap is formed by removal of the conductor material layer by means of a laser.