Laser Processing Apparatus with 3D Imaging Feedback
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Solution Overview
Problem
The existing laser processing methods for semiconductor wafers require manual adjustment of processing conditions such as power, repetition frequency, and focused spot diameter, leading to reduced productivity and the need for trial-and-error settings, which are time-consuming and dependent on the specific characteristics of each wafer.
Innovation Solution
A laser processing apparatus equipped with three-dimensional imaging means and control means that automatically adjusts processing conditions by inputting desired results and forming three-dimensional images to control the laser beam and movement, using experimental design to iteratively refine settings until the desired groove depth is achieved.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual trial-and-error adjustment of processing conditions is performed, then processing precision can be achieved, but productivity is reduced and time is lost
Solution Approach 1:
The system performs preliminary actions by automatically calculating optimal processing conditions (power, repetition frequency, pulse width, focused spot diameter, work feed speed) based on input parameters before actual laser processing begins. This eliminates the need for manual trial-and-error adjustments during production, thereby improving both precision and productivity.
Solution Approach 2:
The system serves itself by automatically determining processing conditions without requiring operator intervention for parameter adjustment. The control unit computes optimal settings based on the relationship between processing factors and groove depth, enabling the system to self-adjust for different wafer characteristics and maintain precision while improving productivity.
2Adaptability or versatility
If manual adjustment of processing conditions is performed for each wafer, then adaptability to different wafer characteristics is achieved, but time consumption increases
Solution Approach 1:
The system automatically changes processing parameters (power, repetition frequency, pulse width, focused spot diameter, work feed speed) based on input wafer characteristics. The control unit calculates optimal parameter combinations adapted to each wafer's specific properties, enabling quick adaptation without manual time-consuming adjustments.
Solution Approach 2:
The patent replaces the mechanical/manual system of parameter adjustment with an automated computational system. The control unit uses algorithms to determine optimal processing conditions, substituting human operator actions with automated electronic control, thereby reducing time loss while maintaining adaptability.
3Manufacturing precision
If processing conditions are optimized for precision, then groove depth accuracy is improved, but the complexity of parameter adjustment increases
Solution Approach 1:
The control unit serves multiple functions: it receives input parameters, calculates optimal processing conditions, controls laser beam parameters, and adjusts work feed speed. This multi-functionality consolidates complex parameter adjustments into a single integrated system, improving groove depth control while managing complexity through centralization.
Solution Approach 2:
The system incorporates feedback mechanisms where the control unit continuously monitors processing results and adjusts parameters accordingly. By measuring actual groove depth and comparing it with target values, the system refines parameter settings to maintain precision while simplifying the adjustment process through automated closed-loop control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for automatic setting of processing conditions, eliminating the need for manual trial-and-error adjustments, thereby improving productivity and adaptability to different wafer characteristics.
Implementation Method 1
applying a laser beam having an absorption wavelength to the wafer along the division lines to thereby form a laser processed groove as a break start point along each division line by ablation
Implementation Method 2
three-dimensional imaging means for imaging a processed condition of the workpiece held by the workpiece holding means to form a three-dimensional image
Data Source
AI summary
A laser processing apparatus includes a laser beam applying unit having a processing head for applying a laser beam to a workpiece held on a chuck table, a moving unit for relatively moving the chuck table and the laser beam applying unit, a controller for controlling the laser beam applying unit and the moving unit, an input unit for inputting a desired processing result, and a three-dimensional imaging unit for imaging a processed condition of the workpiece held on the chuck table to form a three-dimensional image. The controller adjusts processing conditions so as to obtain the desired processing result input by the input unit according to the desired processing result and the three-dimensional image formed by the three-dimensional imaging unit, and then controls the laser beam applying unit and the moving unit according to the processing conditions adjusted in the processing conditions adjusting step.