Laser Processing Device Internal Fracture Imaging

The patent replaces the mechanical cross-section observation method with an optical imaging method. The imaging device captures images of the modified region and fracture through the wafer surface using transmitted light, eliminating the need for physical sectioning and direct visual inspection of cut surfaces. This substitution maintains measurement precision while significantly reducing time loss.

The patent creates an optical copy (image) of the internal modified region and fracture state through the wafer surface. Instead of physically exposing the cross-section, the imaging device produces a visual representation of the internal structure, allowing assessment without physical intervention. This copying approach preserves measurement accuracy while avoiding time-consuming physical sectioning.

The patent replaces complex mechanical cross-sectioning equipment and observation systems with a simpler optical imaging device. The imaging device uses transmitted light to visualize the modified region and fracture through the intact wafer surface, eliminating the need for sectioning machinery and complex cross-section preparation equipment.

The patent creates a visual copy of the internal modified region and fracture state through optical imaging. This image-based approach simplifies the observation system compared to physical cross-sectioning, as it requires no mechanical sectioning equipment, sample preparation tools, or complex mounting apparatus. The imaging device directly captures the internal structure through the transparent wafer surface.