Integrated Laser Processing Head with On-Axis 3D Measurement
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Solution Overview
Problem
Laser processing systems face challenges in accurately measuring the position and processing quality of objects due to thermal displacement and aging of mechanical components, which affect the relative positional relationship between the processing head and measurement devices, leading to errors in three-dimensional measurement data.
Innovation Solution
Incorporating an illumination-light emitting section and a light receiving section in the processing head, aligned along the optical axis, to emit and receive illumination light reflected from the object, allowing for three-dimensional measurement data acquisition that corrects for positional variations caused by thermal displacement or aging, thereby improving measurement accuracy and processing quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the processing head and light receiving section are positioned separately to enable measurement function, then measurement capability is improved, but measurement precision deteriorates due to thermal displacement and aging affecting relative positional relationship
Solution Approach 1:
The patent combines the illumination-light emitting section and light receiving section into an integrated measurement device that moves together with the processing head. This merging ensures that both measurement components maintain a fixed relative positional relationship, eliminating measurement errors caused by thermal displacement and aging that would occur if they were separately positioned.
Solution Approach 2:
The patent creates a measurement device that replicates the positional and operational characteristics of the processing head. By copying the head's movement and positioning system, the measurement device accurately tracks the irradiated point's three-dimensional position without suffering from relative positional drift between separate components.
2Duration of action of stationary object
If the processing head is subjected to thermal displacement or aging, then operational duration is improved, but measurement precision deteriorates due to variation in relative positional relationship
Solution Approach 1:
The measurement device is merged with the processing head as an integrated unit, ensuring that both components undergo identical thermal displacement and aging effects. This eliminates relative positional variation between the measurement components and the processing head, maintaining measurement precision throughout the operational duration.
Solution Approach 2:
The patent replaces separate mechanical positioning systems for the measurement device with an integrated system that moves with the processing head. This substitution eliminates the need for precise long-term mechanical positioning between separate components, reducing errors from thermal displacement and aging.
3Device complexity
If separate measurement device is used to avoid interference with processing head, then device complexity is reduced, but measurement precision deteriorates due to positional variation
Solution Approach 1:
The patent merges the measurement device with the processing head into a single integrated unit. This eliminates the complexity of coordinating separate devices and maintaining their relative positioning, while simultaneously improving measurement precision by eliminating relative positional variation between components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise investigation and correction of positional commands for the processing head and verification of processing quality, reducing the influence of thermal displacement or aging, thus enhancing processing accuracy and quality by canceling out errors in three-dimensional measurement data.
Implementation Method 1
a light receiving section located in a predetermined positional relationship with the illumination-light emitting section, and configured to receive a reflection of the illumination light reflected at an irradiated point on the object
Implementation Method 2
a measurement section configured to process the reflection received by the light receiving section and obtain three-dimensional measurement data of the irradiated point
Data Source
AI summary
A laser processing system having a measurement function. The laser processing system includes a processing head configured to irradiate an object with a laser beam in a scanning manner via an optical system for processing; an illumination-light emitting section provided in the processing head, and configured to cause illumination light to be emitted from the processing head toward the object along an optical axis of the optical system for processing; a light receiving section located in a predetermined positional relationship with the illumination-light emitting section, and configured to receive a reflection of the illumination light reflected at an irradiated point on the object; and a measurement section configured to process the reflection received by the light receiving section and obtain three-dimensional measurement data of the irradiated point.