Laser Processing With In-Situ Measurement for Thermal-Free Precision
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Solution Overview
Problem
Existing processing technologies for objects, such as those described in US2002/0017509A1, DE 10 2016 124742 A1, and EP 1 935 553 B1, lack improvements in convenience and performance, particularly in the precision and efficiency of processing methods using laser light.
Innovation Solution
A processing system and method that utilizes a laser light source, optical systems, and a stage apparatus to perform precise removal and non-thermal processing of workpieces, including surface cutting, grinding, and polishing, with integrated measurement and observation capabilities to enhance control and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light is used for processing workpieces, then processing speed and efficiency are improved, but thermal effects cause distortion and reduce manufacturing precision
Solution Approach 1:
The patent transforms continuous laser light into ultra-short pulse light with duration of 1 picosecond or less, fundamentally changing the temporal parameter of the light source. This parameter change enables the laser to interact with material on an ultrafast timescale before thermal diffusion can occur, achieving ablation without thermal damage zone
Solution Approach 2:
The patent employs periodic pulsed laser irradiation where the laser is switched on and off in ultra-short cycles. Each pulse delivers energy for ablation, then the interval between pulses allows the material to cool without significant heat diffusion, creating a periodic cycle of ablation and cooling that prevents cumulative thermal damage
2Loss of substance
If conventional laser processing is used, then material removal is achieved, but thermal diffusion causes recast layers and reduces surface quality
Solution Approach 1:
The patent utilizes phase transition from solid to plasma state through ultrafast laser ablation. The ultra-short pulse duration causes the material to transition directly from solid phase to plasma phase without passing through liquid phase, preventing the formation of recast layers and ensuring clean ejection of ablated material
Solution Approach 2:
The patent replaces conventional thermal-based material removal mechanisms with a mechanical-like ejection process. The ultrafast laser pulse creates a shockwave that mechanically ejects material from the surface, substituting the thermal melting and vaporization process with a more controlled ablation mechanism that leaves no recast layer
3Device complexity
If traditional processing methods are used, then equipment complexity is low, but measurement and control accuracy are insufficient
Solution Approach 1:
The patent merges the laser processing system with an integrated measurement and observation system into a single unified apparatus. The measurement system including microscope, camera, and position detection devices is combined with the laser delivery system, allowing simultaneous processing and real-time measurement without requiring separate equipment
Solution Approach 2:
The patent implements real-time feedback control where the measurement system continuously monitors the workpiece surface during laser processing, and the control system adjusts laser parameters based on this feedback. The position detection device tracks the focal point position and provides feedback to maintain optimal focusing conditions throughout the processing operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved precision and efficiency in processing workpieces by minimizing thermal effects and utilizing advanced optical and mechanical controls, resulting in enhanced processing capabilities.
Implementation Method 1
a laser light source configured to emit light with a duration of 1 picosecond or less
Implementation Method 2
an optical system configured to transmit the light emitted by the laser light source toward the workpiece
Implementation Method 3
When the workpiece is irradiated with pulsed light, a part of the workpiece is removed. The removal processing may be performed by using thermal processing or non-thermal processing
Data Source
Figure 1
Figure 2A~2C
Figure 3A~3C
AI summary
A processing system has: a housing that houses an object; a processing apparatus that is disposed in the housing and that processes the object; a measurement apparatus that is disposed in the housing and that measures the object processed by the processing apparatus; and a control apparatus that sets a processing condition by using a measured result of the obj ect.