Laser Processing Apparatus Liquid Flow Debris Prevention
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Solution Overview
Problem
Existing laser processing methods face challenges in preventing debris adhesion to workpieces during processing, which can lower processing quality and hinder laser beam irradiation due to generated bubbles when using liquid resin or water immersion.
Innovation Solution
A laser processing apparatus with a liquid supply mechanism that includes a circular-disc-shaped transparent plate and rotation mechanism to create a flow velocity, allowing the laser beam to pass through the liquid and preventing bubble interference, while suppressing debris adhesion without using liquid resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the surface of a wafer is covered by a liquid resin to prevent adhesion of debris, then the processing quality is ensured, but additional steps of applying and removing the liquid resin are necessary, reducing productivity
Solution Approach 1:
The invention extracts and removes the liquid resin covering step from the processing workflow. Instead of applying liquid resin to cover the wafer surface, the system uses a liquid flow mechanism that actively removes debris from the processing area, eliminating the need for resin application and removal steps while maintaining debris prevention
Solution Approach 2:
The invention introduces a liquid flow as an intermediary medium between the laser beam and the wafer surface. This liquid flow serves as a dynamic barrier that prevents debris adhesion without requiring static resin coating, allowing continuous processing without additional preparation or cleanup steps
2Manufacturing precision
If the wafer is irradiated with a laser beam in the state in which the wafer is immersed in water to prevent debris adhesion, then debris is prevented from adhering to the surface, but minute bubbles are generated that hinder the traveling of the laser beam
Solution Approach 1:
The invention transforms the static water immersion method into a dynamic liquid flow system. The liquid flows continuously across the wafer surface at controlled velocities, creating a dynamic environment that prevents bubble accumulation and maintains consistent laser beam transmission while still preventing debris adhesion
Solution Approach 2:
The invention changes the parameters of the liquid medium by controlling its flow velocity rather than simply immersing the wafer. By adjusting the flow velocity to specific ranges, the system optimizes both debris prevention and laser beam transmission, preventing bubble formation that would occur in static immersion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uninterrupted laser beam irradiation and prevents debris adhesion to workpieces, maintaining processing quality without the need for liquid resin application or removal, thus enhancing productivity and economic efficiency.
Implementation Method 1
a liquid supply mechanism that supplies a liquid to a gap between the circular-disc-shaped transparent plate and an upper surface of the workpiece
Implementation Method 2
a rotation mechanism that rotates the circular-disc-shaped transparent plate and generates a flow velocity in the liquid supplied to the gap
Implementation Method 3
a condenser that condenses the laser beam emitted from the laser oscillator and irradiates the workpiece held by the holding table with the laser beam transmitted through the transparent plate and the liquid supplied to the gap
Implementation Method 4
a type of apparatus that forms grooves serving as points of origin of dividing by ablation processing in which the focal spot of a laser beam with such a wavelength as to be absorbed by a workpiece is positioned at the surface of the workpiece
Data Source
AI summary
A liquid supply mechanism disposed over a holding unit of laser processing apparatus includes a liquid chamber having a circular-disc-shaped transparent plate positioned to form a gap between the circular-disc-shaped transparent plate and an upper surface of the workpiece held by the holding table, a liquid supply nozzle that supplies a liquid from one side of the liquid chamber to the gap, a liquid discharge nozzle that discharges the liquid from the other side of the liquid chamber, and a rotation mechanism that rotates the circular-disc-shaped transparent plate and generates a flow velocity in the liquid supplied to the gap. The laser beam irradiation unit includes a laser oscillator that emits a laser beam and a condenser that condenses the laser beam emitted from the laser oscillator and irradiates the workpiece with the laser beam transmitted through the transparent plate and the liquid supplied to the gap.