Laser Processing Apparatus Liquid Supply Mechanism
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Solution Overview
Problem
Laser processing of plate-shaped workpieces is hindered by debris adhesion and air bubbles when using traditional methods, leading to reduced productivity and processing quality.
Innovation Solution
A laser processing apparatus with a liquid supply mechanism that uses a transparent plate and linear-motion mechanism to maintain a liquid layer between the workpiece and the laser beam, preventing debris adhesion and air bubble interference by continuously circulating and filtering the liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the top surface of the wafer is coated with a liquid resin to prevent debris adhesion, then processing quality is ensured, but productivity decreases due to the need for applying and removing the liquid resin
Solution Approach 1:
A liquid layer is introduced as an intermediary medium between the laser beam and the workpiece surface. This liquid layer captures debris particles that would otherwise adhere to the workpiece, while being continuously circulated and filtered to maintain processing quality without requiring pre-coating or post-removal steps
Solution Approach 2:
The liquid circulation system automatically performs the debris removal function during the laser processing operation itself. The liquid is continuously supplied, circulated through a filter, and reused, creating a self-sustaining system that maintains processing quality without external intervention for coating application or removal
2Manufacturing precision
If the workpiece is irradiated with a laser beam in a submerged state to prevent debris adhesion, then debris floats in water, but air bubbles occur and hinder laser beam advance
Solution Approach 1:
A liquid circulation system is implemented where liquid is continuously pumped through the processing area and filtered. This hydraulic approach prevents air bubble accumulation by maintaining constant liquid flow, while the filter captures debris particles, solving both the debris adhesion and laser transmission problems
Solution Approach 2:
The liquid is continuously circulated throughout the laser processing operation, maintaining constant protection against debris adhesion and continuous removal of air bubbles. This continuous action ensures uninterrupted laser beam transmission and consistent processing quality
3Manufacturing precision
If a liquid resin is used to prevent debris adhesion, then processing quality is maintained, but economic efficiency decreases because the liquid resin cannot be used repeatedly
Solution Approach 1:
The liquid circulation system recovers and reuses the liquid medium throughout the processing operation. A filter captures debris particles from the liquid, allowing the cleaned liquid to be continuously reused, eliminating the need for repeated liquid resin application and disposal
Solution Approach 2:
The system includes an integrated filtration mechanism that automatically removes debris from the circulating liquid, enabling the liquid to serve itself by maintaining its own cleanliness and usability throughout extended processing operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uninterrupted laser irradiation and prevents debris adhesion on the workpiece, maintaining processing quality without the need for pre-coating with liquid resin, thus enhancing productivity and economic efficiency.
Implementation Method 1
a condenser configured to condense the laser beam emitted from the laser oscillator and irradiate the workpiece held on the holding table with the laser beam through the transparent plate and the liquid supplied to the gap
Implementation Method 2
debris (laser processing waste) occurring when the top surface of the wafer is irradiated with the laser beam scatters and adheres to the top surfaces of devices formed on the wafer
Implementation Method 3
a linear-motion mechanism configured to linearly move the transparent plate over the liquid chamber
Data Source
AI summary
A liquid supply mechanism is disposed on an upper portion of a holding unit of a laser processing apparatus. The liquid supply mechanism includes: a liquid chamber having a transparent plate positioned such that a gap is formed between the transparent plate and the top surface of a workpiece held on a holding table; a linear-motion mechanism configured to linearly move the transparent plate over the liquid chamber; a liquid supply nozzle configured to supply a liquid from one side of the liquid chamber to the gap; and a liquid discharge nozzle configured to discharge the liquid from another side of the liquid chamber. A laser beam irradiating unit includes a laser oscillator configured to irradiate the workpiece through the transparent plate and the liquid supplied to the gap.