Laser Processing Device with Offset Optical Axis

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Laser processing devices using optical elements like mirrors are prone to damage due to shock waves and ultrasonic waves generated during laser peening, particularly in applications like nuclear reactors, where the optical elements are affected by plasma-induced stress and vibrations.

Innovation Solution

A laser processing device design featuring a light irradiation section with a first and second transparent member, where the optical axis of the laser beam passing through the first surface and the convex surface are different, allowing for the emission of a laser beam through a gap between the optical fiber and the optical element, enabling micro-vibration and absorption of shock waves, thus preventing damage to the optical element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If an optical element such as a mirror is used to converge the laser beam on the metal surface, then the laser beam can be effectively focused, but the optical element is damaged by shock waves and ultrasonic waves generated by plasma

Engineering Contradiction:

Improvelaser beam focusing precisionVSAvoidoptical element durability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent removes the optical element (mirror) from the system entirely and replaces it with a light-irradiation section that directly emits and focuses the laser beam through its tip. This extraction eliminates the vulnerable component while maintaining the laser beam convergence function, thereby resolving the contradiction between focusing precision and optical element durability.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces water as an intermediary medium between the light-irradiation section and the metal surface. The water serves multiple functions: it transmits the laser beam effectively, absorbs shock waves and ultrasonic waves generated by plasma, and protects the light-irradiation section from damage. This intermediary approach maintains laser focusing capability while preventing damage to the light source.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the laser beam is emitted directly onto the metal surface without water, then processing efficiency is improved, but the optical element is exposed to harmful shock waves and ultrasonic waves

Engineering Contradiction:

Improvelaser processing efficiencyVSAvoidshock wave and ultrasonic wave damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

Water is introduced as an intermediary medium that does not significantly reduce laser processing efficiency while effectively absorbing shock waves and ultrasonic waves. The water layer allows the laser beam to reach the metal surface for efficient processing while protecting the light-irradiation section from harmful physical effects generated by plasma.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent converts the harmful shock waves and ultrasonic waves generated by plasma into a beneficial protective mechanism. By having water present during laser irradiation, the harmful waves are absorbed and dissipated in the water medium, transforming what would be damaging forces into a protective effect that shields the light-irradiation section while allowing continued high-efficiency processing.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device effectively prevents damage to the optical element by allowing it to micro-vibrate and absorb shock waves, enhancing the light-converging power and enabling precise laser peening on narrow surfaces without the need for mirrors, thereby maintaining the integrity of the optical components.

Implementation Method 1

laser peening for irradiating a metal surface in water with the laser beam to change the composition of the metal surface using a shock wave of the plasma generated by the irradiation with the laser beam

Methodology Applied

Scientific EffectLaser peening: Laser Peening

Implementation Method 2

using a shock wave of the plasma generated by the irradiation with the laser beam

Methodology Applied

Scientific EffectShock wave: Shock Wave

Implementation Method 3

The first transparent member includes a first surface opposed to the tip of the light irradiation section, and a second surface provided so as to be connected to the first surface. The second transparent member includes a flat surface and a convex surface

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS10946481B2Laser processing device

Publication Date: 2021.03.16 KK TOSHIBA

AI summary

According to one embodiment, a laser processing device includes a light irradiation section, and an optical element. The optical element includes a first transparent member provided via a gap with a tip of the light irradiation section, and a second transparent member. The first transparent member includes a first surface opposed to the tip of the light irradiation section, and a second surface provided so as to be connected to the first surface. The second transparent member includes a flat surface and a convex surface, the flat surface being provided so as to be opposed to the second surface of the first transparent member, the light passed through the first transparent member passing through the convex surface. An optical axis of the laser beam passing through the first surface and an optical axis passing through the convex surface are different from each other.