Laser Beam Processing Machine Single Condenser Lens Multi-Point Focusing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing laser beam processing machines require multiple passes and adjustments to form thick deteriorated layers in wafers, as a shallow focusing point obstructs the application of a deep focusing point, making precise wafer division time-consuming and inefficient.

Innovation Solution

A laser beam processing machine with a transmitting/converging means using a single condenser lens, beam splitter, and adjustable mirrors to converge laser beams at multiple focusing points displaced in both the processing-feed and thickness directions, allowing simultaneous formation of deteriorated layers without interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a pulse laser beam is focused at a shallow point in the wafer, then the laser beam can be applied effectively, but it obstructs the application of a laser beam with a deep focusing point, making it impossible to form multiple deteriorated layers simultaneously

Engineering Contradiction:

Improvesimultaneous formation of multiple deteriorated layersVSAvoidobstruction of laser beam

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies dimensional change by displacing focusing points not only in the thickness direction (depth) but also in the processing-feed direction (lateral dimension). This creates spatial separation between laser beams in three-dimensional space, allowing multiple beams to coexist without obstruction. The transmitting/converging means generates focusing points that are offset in both axial and lateral directions, transforming a one-dimensional depth problem into a three-dimensional spatial solution.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the thickness of the deteriorated layer is increased to enable precise wafer division, then multiple passes with repeated relative movement are required, making the process time-consuming

Engineering Contradiction:

Improveprecision of wafer divisionVSAvoidtime to form deteriorated layer

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent merges multiple laser processing operations into a single simultaneous operation. By generating multiple focusing points that can form deteriorated layers at different depths and positions concurrently, the system combines what would otherwise require sequential processing into one unified operation. This eliminates the need for repeated relative movements and multiple passes, achieving both thick deteriorated layers and high precision wafer division in a single pass.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent enables continuous formation of deteriorated layers throughout the wafer thickness in a single uninterrupted operation. The transmitting/converging means maintains continuous laser beam application while generating multiple focusing points simultaneously, eliminating the intermittent stopping and repositioning required in conventional multi-pass methods. This continuous action maintains productivity while achieving the necessary deteriorated layer thickness for precise division.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the simultaneous formation of multiple deteriorated layers with desired thicknesses without obstruction, improving the efficiency and precision of wafer division by allowing independent adjustment of focusing points.

Implementation Method 1

a single condenser lens for converging laser beams transmitted by the optical transmission means, wherein the transmitting/converging means causes a laser beam oscillated from the laser beam oscillation means to converge on two or more focusing points which are displaced in the processing-feed direction and in the thickness direction of the workpiece held on the chuck table through the single condenser lens

Methodology Applied

Scientific EffectLaser beam convergence: Focusing

Implementation Method 2

a laser beam oscillation means and a transmitting/converging means having an optical transmission means for transmitting a laser beam oscillated by the laser beam oscillation means

Methodology Applied

Scientific EffectLaser oscillation: Laser

Data Source

PatentUS7482553B2Laser beam processing machine

Publication Date: 2009.01.27 DISCO CORP

AI summary

A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam capable of passing through the workpiece to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, the laser beam application means comprising a laser beam oscillation means, an optical transmission means for transmitting a laser beam oscillated by the laser beam oscillation means, and a transmitting/converging means having a single condenser lens for converging laser beams transmitted by the optical transmission means, wherein the transmitting/converging means converges a laser beam oscillated from the laser beam oscillation means at two or more focusing points which are displaced in the direction of the optical axis and the processing-feed direction through the single condenser lens.