Laser Processing Transparent Data Carrier Elements
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Solution Overview
Problem
Existing methods for producing data carriers with transparent or translucent elements, such as smart cards, are cumbersome and costly due to low throughput and high manufacturing costs associated with processes like pick-and-place insertions.
Innovation Solution
A method involving laser cutting and sealing of a processing layer onto a background layer using electromagnetic radiation to form target elements, allowing for high-throughput and low-cost production of transparent or translucent elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transparent or translucent elements are introduced into polycarbonate cards using pick-and-place insert process, then the data carrier achieves authentication functionality, but the manufacturing throughput is low and costs are high
Solution Approach 1:
The patent merges the transparent element and the polycarbonate card into a single integrated structure by forming the transparent element directly within the card material using laser processing, eliminating the need for separate insertion steps. This combining of components resolves the contradiction by maintaining authentication functionality while dramatically improving manufacturing throughput through a unified production process.
Solution Approach 2:
The patent replaces the mechanical pick-and-place insertion system with a laser-based processing system that directly forms transparent elements within the card material. This substitution of mechanical assembly with optical/thermal processing resolves the contradiction by enabling continuous high-speed manufacturing while maintaining the authentication functionality of transparent elements.
2Reliability
If transparent or translucent elements are introduced using pick-and-place insert process, then authentication elements are provided in the data carrier, but manufacturing costs are high
Solution Approach 1:
The patent extracts the transparent element formation process from the separate component insertion process and integrates it directly into the card manufacturing workflow. By taking out the need for separate transparent element components and their insertion, the patent reduces material costs and manufacturing complexity while maintaining authentication functionality.
Solution Approach 2:
The patent employs a cost-effective approach by forming transparent elements directly in the card material using laser processing, eliminating the need for expensive pre-manufactured transparent components. This direct formation method uses minimal additional material and processing resources, significantly reducing manufacturing costs while maintaining authentication functionality.
3Productivity
If laser radiation is used to cut and seal processing layer to background layer, then high-throughput production is achieved, but precise control of target element formation is required
Solution Approach 1:
The patent implements feedback control in the laser processing system by monitoring the laser parameters, material response, and processing results in real-time. This feedback mechanism allows precise adjustment of laser power, speed, and focus to maintain accurate target element formation while operating at high production speeds, resolving the contradiction between throughput and precision.
Solution Approach 2:
The patent utilizes precise control of laser parameters (power, pulse duration, frequency, focal position) to achieve accurate target element formation. By dynamically adjusting these parameters during processing, the system maintains manufacturing precision while operating at high speeds, resolving the contradiction between productivity and precision in laser-based transparent element formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient and cost-effective creation of transparent or translucent elements in data carriers, providing flexibility in shape and location, with improved manufacturing efficiency and reduced costs.
Implementation Method 1
the processing layer at regions of impingement of the electromagnetic radiation is cut and sealed to the background layer
Implementation Method 2
the processing layer at regions of impingement of the electromagnetic radiation is cut and sealed to the background layer
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
A method of producing a data carrier (1) comprising at least one target element (2) comprises the steps of i) arranging a processing layer (3) and a background layer (4) above one another, ii) irradiating electromagnetic radiation (R) onto the processing layer (3), wherein the processing layer (3) at regions of impingement of the electromagnetic radiation (R) is cut and sealed to the background layer (4), and iii) removing the processing layer (3) after the irradiation of the electromagnetic radiation (R), wherein a remaining part (5) of the processing layer (3) being sealed to the background layer (4) remains on the background layer (4), whereby the at least one target element (2) is formed.