Laser Processing Apparatus Wafer Transport Route Separation
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Solution Overview
Problem
The existing laser processing apparatuses face inefficiencies in processing wafers as the route of carrying a processed wafer overlaps with the route of carrying an unprocessed wafer, leading to reduced productivity.
Innovation Solution
A laser processing apparatus is designed with a carrying-out mechanism that allows the processed wafer to be directly carried from the chuck table and accommodated into a cassette, avoiding overlap with the unprocessed wafer's carrying route, utilizing a robot hand and guide rails for efficient movement, and a periphery detecting section for precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the processed wafer is returned to the temporary placing means before being accommodated into the cassette, then the wafer can be processed with high accuracy by reciprocating the chuck table, but the carrying route of the processed wafer overlaps with the carrying route of the unprocessed wafer, reducing productivity
Solution Approach 1:
The patent segments the wafer carrying routes into two separate paths: one for carrying unprocessed wafers from the cassette to the chuck table, and another for carrying processed wafers from the chuck table directly back to the cassette. This segmentation eliminates the overlap between carrying routes, allowing simultaneous operations without interference, thereby improving productivity while maintaining processing accuracy through the preserved chuck table reciprocation mechanism.
2Device complexity
If the carrying-out means is positioned to return processed wafers through the temporary placing means, then the system structure is simplified, but the carrying routes overlap causing waiting time and reduced throughput
Solution Approach 1:
The patent introduces a spatial dimension change by positioning the carrying-out means to operate in a different spatial path than the carrying means. The carrying-out means moves processed wafers in a direction that bypasses the temporary placing means location, creating a parallel carrying route. This dimensional separation allows both carrying and carrying-out operations to occur simultaneously without route overlap, significantly improving wafer throughput while maintaining manageable system complexity through standardized mechanical components.
3Manufacturing precision
If the chuck table reciprocates for high-precision processing, then processing accuracy is improved, but the overlapping carrying routes require sequential operations increasing processing time
Solution Approach 1:
The patent enables continuous useful action by allowing the carrying means and carrying-out means to operate simultaneously and independently. While the chuck table reciprocates for precision laser processing, the carrying means can load a new unprocessed wafer onto the chuck table, and the carrying-out means can simultaneously remove a processed wafer from the chuck table and return it to the cassette. This eliminates idle waiting time between loading and unloading operations, maintaining continuous processing flow and reducing overall processing time while preserving the precision benefits of chuck table reciprocation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient processing of wafers by separating the carrying routes of processed and unprocessed wafers, enhancing productivity by allowing continuous processing without interference.
Implementation Method 1
laser beam applying means including a focusing unit for applying a laser beam to the workpiece held on the chuck table
Data Source
AI summary
A laser processing apparatus for processing a plate-shaped workpiece by applying a laser beam to the workpiece, includes a cassette table for placing thereon a cassette in which a plurality of workpieces are accommodated, a carrying-out unit for carrying out the workpiece from the cassette placed on the cassette table, and a laser beam applying unit including a focusing unit for applying the laser beam to the workpiece held on the chuck table. The carrying-out unit carries out the workpiece having been processed by the laser beam applying unit from the chuck table, and accommodates the workpiece into the cassette placed on the cassette table.