Bandwidth-Broadened Laser Pulse Compression for Cold Semiconductor Machining
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Solution Overview
Problem
Conventional micro machining processes using diamond cutters are inefficient for processing compound semiconductor materials like silicon carbide due to their high hardness, and high-energy pulsed lasers with picosecond or femtosecond durations cause thermal degradation, failing to meet the requirements for high-end products.
Innovation Solution
A laser machining device comprising a pulsed laser generator, bandwidth broadening unit, and pulse compression unit is used to emit, broaden, and compress pulsed lasers to achieve a pulse duration of less than 50 fs, enabling efficient processing of compound semiconductors with reduced thermal effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high energy pulsed laser with picosecond or femtosecond duration is used for micro machining compound semiconductor materials, then the machining capability is improved, but thermal effect causes deterioration of material properties
Solution Approach 1:
The patent changes the pulse duration parameter from picosecond/femtosecond range to sub-50 femtosecond range, and adjusts energy distribution to achieve cold ablation. By compressing the pulse duration to extremely short periods (less than 50 fs) and controlling the energy delivery timing, the system achieves machining capability while minimizing thermal diffusion and material property deterioration.
2Ease of manufacture
If conventional micro machining process with diamond cutters is used, then the process is simple, but it cannot efficiently process compound semiconductor materials due to high hardness
Solution Approach 1:
The patent replaces the mechanical diamond cutter system with a laser-based system. Instead of using mechanical force to cut through hard compound semiconductor materials, the system uses focused laser energy to ablate the material, achieving efficient processing without the limitations of mechanical cutting tools.
3Use of energy by moving object
If pulsed laser with longer duration is used, then the energy delivery is sufficient, but the pulse duration cannot satisfy high-end product requirements
Solution Approach 1:
The system uses ultra-short periodic laser pulses with duration less than 50 fs, delivering energy in extremely brief intervals. This periodic action with precisely controlled pulse width achieves both sufficient energy delivery for machining and the precise temporal control required for high-end product manufacturing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device forms a high-quality surface treatment layer on compound semiconductors by breaking chemical bonds with minimal thermal impact, improving machining yield and quality.
Implementation Method 1
The bandwidth broadening unit is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser
Implementation Method 2
the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser
Implementation Method 3
processing a compound semiconductor material by the short duration pulsed laser to form a surface treatment layer on the compound semiconductor material
Implementation Method 4
breaking chemical bonds with minimal thermal impact
Data Source
AI summary
A laser machining device includes a pulsed laser generator, an accommodation chamber, a bandwidth broadening unit and a pulse compression unit. The pulsed laser generator is configured to emit a pulsed laser. The accommodation chamber has a gas inlet. The bandwidth broadening unit is disposed in the accommodation chamber, and is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser. The pulse compression unit is disposed in the accommodation chamber. The bandwidth broadening unit and the pulse compression unit are arranged in order along a laser propagation path, and the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser.