Laser Pulse Contour Correction for EUV Optical Components
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Solution Overview
Problem
Current methods for generating optical components and wafers fail to effectively address the increasing demands for high precision and planarity, especially in extreme ultraviolet (EUV) applications, leading to defects and performance losses in semiconductor devices due to substrate deviations and bending issues during manufacturing.
Innovation Solution
A method involving the determination of existing three-dimensional contour deviations and the calculation of specific three-dimensional arrangements of laser pulses to correct and generate predetermined contours, using a 3D approach that accounts for volume deformations and material parameters to achieve precise corrections and fabrications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing processes are used for EUV optical components, then production cost and complexity are reduced, but planarity and manufacturing precision deteriorate
Solution Approach 1:
The patent applies preliminary action by performing planarity correction through laser pulse treatment before the final manufacturing steps. The method determines existing contour deviations, calculates appropriate laser pulse arrangements, and applies them to pre-correct the substrate planarity before subsequent EUV mirror or mask fabrication processes, ensuring that base planarity requirements are met beforehand
Solution Approach 2:
The patent employs parameter changes by systematically varying laser pulse parameters including energy density, pulse duration, wavelength, and spatial arrangement to achieve precise planarity control. The method calculates optimal parameter combinations based on measured deviations and material properties, transforming the substrate contour through controlled physical parameter adjustments
2Reliability
If substrate planarity is not corrected, then manufacturing process is simpler, but optical performance and reliability deteriorate
Solution Approach 1:
The patent implements feedback by measuring the actual three-dimensional contour of the substrate, comparing it against predetermined specifications, and using this information to calculate and apply corrective laser pulse arrangements. This closed-loop approach ensures that reliability requirements are met by continuously monitoring and adjusting the planarity based on actual measurements
3Manufacturing precision
If laser pulse correction is applied, then planarity and manufacturing precision are improved, but process time and energy consumption increase
Solution Approach 1:
The patent applies segmentation by dividing the correction process into discrete steps: measuring the contour, determining deviations, calculating pulse arrangements, and applying corrections in multiple passes if necessary. This segmented approach allows for efficient processing by focusing laser pulses only on specific regions requiring correction rather than treating the entire substrate uniformly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the simultaneous correction of deviations and fabrication of specific optical components, improving planarity and reducing defects, thereby enhancing the performance and reliability of EUV optical components and wafers.
Implementation Method 1
modifying a mass density and/or an optical transmission of the optical component by a stress distribution induced by a strain distribution caused by laser pulses
Implementation Method 2
applying the calculated at least one three-dimensional arrangement of laser pulses on the optical component for generating the predetermined three-dimensional contour
Data Source
AI summary
A method for generating a predetermined three-dimensional contour of a component and/or a wafer comprises: (a) determining a deviation of an existing three-dimensional contour of the component and/or the wafer from the predetermined three-dimensional contour; (b) calculating at least one three-dimensional arrangement of laser pulses having one or more parameter sets defining the laser pulses for correcting the determined existing deviation of the three-dimensional contour from the predetermined three-dimensional contour; and (c) applying the calculated at least one three-dimensional arrangement of laser pulses on the component and/or the wafer for generating the predetermined three-dimensional contour.