Laser Processing Apparatus Pulse Width Adjustment

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Solution Overview

Problem

The existing laser processing apparatuses require multiple configurations to accommodate varying substrate materials and device types, leading to high equipment costs due to the need for different pulse widths for each condition.

Innovation Solution

A laser processing apparatus with a pulse width adjustment unit that includes a laser oscillator, focusing device, and a pulse width adjustment unit composed of quartz bodies with reflection layers, allowing for adjustable pulse widths without the need for multiple equipment setups, by generating a time difference in the wavelength region of the pulsed laser beam.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple laser processing apparatuses with different pulse widths are prepared for different substrate materials and device types, then the adaptability to various processing conditions is improved, but the equipment cost increases significantly

Engineering Contradiction:

Improveadaptability to various substrate materials and device typesVSAvoidequipment cost

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies the dynamics principle by making the pulse width adjustable rather than fixed. The laser processing apparatus can dynamically change its pulse width parameter to match different substrate materials and device types, eliminating the need for multiple dedicated apparatuses. This is achieved through a pulse width adjustment mechanism that modifies the temporal characteristics of the laser beam while maintaining the same hardware platform.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent implements parameter changes by modifying the pulse width parameter of the laser beam. By adjusting this temporal parameter, the same laser processing apparatus can effectively process different substrate materials (such as Si, SiC, GaAs) and device types (LEDs, LDs, ICs) that require different pulse widths, thereby achieving versatility without increasing equipment quantity.

Inventive Principle:

Principle #35Parameter changes

2Device complexity

If a single laser processing apparatus is used for all substrate materials and device types, then the equipment cost is reduced, but the ability to accommodate varying processing conditions deteriorates

Engineering Contradiction:

Improveequipment costVSAvoidadaptability to various substrate materials and device types

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent applies the universality principle by designing a laser processing apparatus that can perform multiple processing functions on different substrate materials and device types. The pulse width adjustment capability enables a single apparatus to universally handle various processing conditions that previously required specialized equipment, making the system multi-functional and cost-effective.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The dynamic adjustment of pulse width allows the single apparatus to adapt its characteristics to match the requirements of different substrate materials and device types, achieving versatility through parameter flexibility rather than through multiple fixed-configuration machines.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables flexible adjustment of pulse widths for different substrate materials, reducing the need for multiple equipment configurations and thus minimizing equipment costs while maintaining effective laser processing capabilities.

Implementation Method 1

a pulse width adjustment unit that is disposed between the laser oscillator and the focusing device and that generates a time difference in a wavelength region of the pulsed laser beam in the line width, thereby adjusting pulse width

Methodology Applied

Scientific EffectReflection: Reflection

Implementation Method 2

generates a time difference in a wavelength region of the pulsed laser beam in the line width

Methodology Applied

Scientific EffectOptical path difference:

Data Source

PatentUS10923873B2Laser processing apparatus

Publication Date: 2021.02.16 DISCO CORP

AI summary

A laser processing apparatus includes: a chuck table that holds a workpiece; a laser beam applying unit that applies a pulsed laser beam having a predetermined line width to the workpiece held by the chuck table; and a processing feeding unit that performs relative processing feeding of the chuck table and the laser beam applying unit. The laser beam applying unit includes: a laser oscillator that oscillates the pulsed laser beam; a focusing device that focuses the pulsed laser beam oscillated by the laser oscillator; and a pulse width adjustment unit that is disposed between the laser oscillator and the focusing device and that generates a time difference in a wavelength region of the pulsed laser beam in the predetermined line width, thereby adjusting the pulse width.