Laser Machining Pulse Width Control for Cross-Machine Consistency

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Solution Overview

Problem

Laser processing apparatuses exhibit machine differences in processing characteristics due to varying specifications and settings, such as beam diameter and objective lens types, leading to inconsistent processing results across multiple machines.

Innovation Solution

A laser processing apparatus that irradiates substrates with processing laser light from one side and observation transmission light from the opposite side, using imaging elements to acquire and adjust pulse widths based on reference data to match desired processing characteristics, thereby minimizing machine differences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If various specifications and settings such as beam diameter and objective lens types are changed in laser processing apparatuses, then processing adaptability is improved, but machine difference in processing characteristics occurs

Engineering Contradiction:

Improveprocessing adaptabilityVSAvoidprocessing characteristic consistency

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent changes the parameter being controlled from beam diameter and objective lens type to pulse width. By adjusting pulse width as the primary control parameter while maintaining standardized optical components, the system achieves both adaptability (through pulse width modulation) and consistency (through standardized hardware configuration), resolving the machine difference issue

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a universal processing parameter (pulse width) that can be applied across different processing conditions and apparatuses. This universal parameter allows different machines to achieve consistent processing characteristics without requiring identical optical specifications, enabling multi-functionality across varied hardware configurations

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If standardized processing parameters are used across multiple laser processing apparatuses, then manufacturing precision is improved, but adaptability to different processing conditions deteriorates

Engineering Contradiction:

Improveprocessing characteristic consistencyVSAvoidprocessing condition adaptability

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent introduces dynamic adjustment capability through pulse width modulation. The pulse width can be dynamically changed based on processing requirements while the underlying hardware remains standardized. This dynamic parameter allows the system to adapt to different processing conditions (different materials, thicknesses, patterns) while maintaining consistent baseline characteristics through standardized apparatus configuration

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively suppresses machine differences in processing characteristics by adjusting pulse widths to achieve uniform results across multiple laser processing machines, ensuring consistent output.

Implementation Method 1

laser light is emitted from a second main surface side opposite to the first main surface of the sapphire substrate. The laser light is condensed to a predetermined position inside the sapphire substrate and is moved (scanned) in a direction parallel to the first main surface to form a peeling interface

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

an imaging element configured to image the observation transmission light from the substrate

Methodology Applied

Scientific EffectLight transmission and imaging: Photography

Data Source

PatentUS20240253154A1Laser machining apparatus, laser machining method, and data generation method

Publication Date: 2024.08.01 HAMAMATSU PHOTONICS KK

AI summary

Provided is a laser processing apparatus configured to irradiate a substrate including a first main surface and a second main surface opposite to the first main surface with processing laser light. The laser processing apparatus includes: a processing irradiation unit configured to irradiate the substrate with the processing laser light from the second main surface side; an observation irradiation unit configured to irradiate the substrate with observation transmission light from the second main surface side; an imaging element configured to image the observation transmission light from the substrate; and a controller configured to execute a processing process of irradiating the substrate with the processing laser light by controlling the processing irradiation unit, and a characteristic acquisition process of irradiating the substrate with the observation transmission light, imaging the observation transmission light from the substrate.