Laser Beam Rastering With AOD Control for Dense Feature Precision

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Solution Overview

Problem

Conventional laser processing technologies face challenges in achieving high accuracy, quality, and throughput when forming small, dense features on workpieces, due to limitations in precision and flexibility.

Innovation Solution

The method involves rastering a laser beam axis relative to the workpiece using positioners, including an acousto-optic deflector, to deliver laser pulses at specific spot locations and scan lines, with the use of multiple scan heads and optics assemblies for precise alignment and thermal management, allowing for the formation of features with improved accuracy and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional laser processing technologies are used to form small, dense features, then manufacturing capability is provided, but manufacturing precision and quality deteriorate due to limitations in precision and flexibility

Engineering Contradiction:
Improvefeature precisionVSAvoidprocessing flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent employs dynamic beam scanning control through multiple scan heads that can independently position and raster the laser beam across the workpiece. The beam axis is dynamically adjusted using positioners and acousto-optic deflectors to deliver pulses at precisely controlled locations, enabling high precision feature formation while maintaining flexibility in processing different feature patterns and densities

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent divides the laser processing system into multiple independent scan heads, each capable of independent beam control and scanning. This segmentation allows different scan heads to handle different regions or feature types simultaneously, improving both precision through specialized control and flexibility through parallel processing of diverse feature patterns

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If laser beam control is enhanced for higher precision, then manufacturing precision improves, but device complexity increases due to multiple positioners and scan heads

Engineering Contradiction:
Improvebeam positioning precisionVSAvoidsystem complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple scan heads and positioners into an integrated laser processing system with coordinated control. The multiple distributors and optics assemblies are merged into a unified architecture where components work together synergistically, managing complexity through integration while maintaining high precision beam positioning capabilities through coordinated operation of all subsystems

Inventive Principle:
Principle #5Merging (Combining)

3Productivity

If multiple scan heads and distributors are used to improve precision and throughput, then productivity increases, but device complexity and thermal management challenges increase

Engineering Contradiction:
Improveprocessing throughputVSAvoidthermal management
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent segments the thermal management function by providing dedicated cooling plates for each acousto-optic deflector and separate thermal management paths for different subsystems. This segmentation allows independent optimization of cooling for each high-power laser source and positioner, effectively managing heat loads across the multi-head system to maintain high productivity without thermal overload

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces multiple distributors as intermediary components that manage the distribution of laser beams and coordination between scan heads. These distributors act as mediators that balance the workload and thermal loads across the system, enabling high throughput by efficiently routing beams while preventing thermal concentration in any single component

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of features with enhanced precision and quality, overcoming the limitations of conventional laser processing by allowing for more precise control over the laser beam and improved thermal management, resulting in improved accuracy and throughput.

Implementation Method 1

moving a beam axis relative to the workpiece using positioner including an AOD

Methodology Applied
Scientific EffectAcousto-optic effect: Acousto-optic Effect

Implementation Method 2

delivering a plurality of laser pulses to the workpiece at a plurality of spot locations

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 3

a first pulse duration sufficiently short so as to induce nonlinear absorption of light within the portion of the workpiece

Methodology Applied
Scientific EffectNonlinear absorption: Absorption (EM radiation)

Implementation Method 4

a cooling plate in thermal contact with a face of the AO cell extending between the ultrasonic transducer and the absorber

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11077526B2Laser processing apparatus, methods of laser-processing workpieces and related arrangements
Publication Date: 2021.08.03 ELECTRO SCI IND INC
  • US11077526B2 patent drawing
  • US11077526B2 patent drawing
  • US11077526B2 patent drawing

AI summary

Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.