Laser Device Recessed Reflecting Member Heat Dissipation

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Solution Overview

Problem

Laser devices face reduced laser light emission efficiency due to heat dissipation issues and distortion of the far-field pattern caused by the presence of sub-mounts between the substrate and laser oscillation units, which also increase the size of the device.

Innovation Solution

A laser device design featuring a substrate with a recess and a reflecting member with an inclined surface positioned inside the recess, allowing the laser oscillation unit to be directly fixed to the substrate with an adhesive, enhancing heat dissipation and reducing the distance between laser elements for improved power density and reduced device size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a sub-mount is placed between the substrate and laser oscillation unit, then heat dissipation is improved, but laser light emission efficiency is reduced and device size increases

Engineering Contradiction:
Improveheat dissipationVSAvoidlaser light emission efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The invention removes the sub-mount component that was previously placed between the substrate and laser oscillation unit. By extracting this intermediate element, the patent achieves direct contact between the laser oscillation unit and substrate, eliminating the thermal resistance barrier while maintaining effective heat dissipation through the substrate itself.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the functions of heat dissipation and laser light emission by allowing the substrate to serve both purposes simultaneously. The substrate directly contacts the laser oscillation unit for heat conduction while also providing the mounting surface, eliminating the need for a separate sub-mount component.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If a sub-mount is placed between the substrate and laser oscillation unit, then heat dissipation is improved, but device size increases

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice size
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The invention extracts and removes the sub-mount component from the device structure. This elimination of the intermediate mounting layer directly reduces the overall device height and volume while maintaining effective thermal management through direct substrate contact.

Inventive Principle:
Principle #2Taking out (Extraction)

3Volume of moving object

If the emission surface is placed close to the substrate, then device size is reduced, but laser light energy is lost and far-field pattern is distorted

Engineering Contradiction:
Improvedevice sizeVSAvoidlaser light energy loss
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The invention utilizes the vertical dimension by creating a recess in the substrate that extends downward. This allows the laser oscillation unit to be positioned in the recess, effectively using the third dimension (depth) to separate the emission surface from the substrate surface while maintaining close proximity for heat dissipation, thus preventing energy loss without increasing device footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves heat dissipation and laser light emission efficiency while preventing energy loss and distortion, resulting in a more compact and efficient laser device.

Implementation Method 1

a reflecting member fixed to a bottom surface of the recess and having an inclined surface that is inclined with respect to the principal surface at a position such that the inclined surface reflects the laser light

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

a laser oscillation unit fixed to the principal surface in direct contact with the principal surface or with an adhesive interposed between the laser oscillation unit and the principal surface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10992103B1Laser device
Publication Date: 2021.04.27 SHARP FUKUYAMA LASER CO LTD
  • US10992103B1 patent drawing
  • US10992103B1 patent drawing
  • US10992103B1 patent drawing

AI summary

A laser device includes a substrate including a principal surface and a recess provided in the principal surface; a laser oscillation unit fixed to the principal surface in direct contact with the principal surface or with an adhesive interposed between the laser oscillation unit and the principal surface, the laser oscillation unit having an emission surface from which laser light that diverges as the laser light travels is emitted along the principal surface; and a reflecting member fixed to a bottom surface of the recess and having an inclined surface that is inclined with respect to the principal surface so as to reflect the laser light. At least a portion of the inclined surface is positioned in a space inside the recess.