Laser Reflow Pressurizing Plate for Faster Bonding and Fume Control
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Solution Overview
Problem
Conventional laser reflow apparatuses are inefficient due to integrated pressurizing and laser emission units, leading to high costs, long tact times, and limited productivity, as well as issues with fume generation causing sticking and damage during the bonding process.
Innovation Solution
A laser reflow apparatus with a separable beam transmission plate and laser emission unit, utilizing a beam transmission plate made of materials like quartz or sapphire, equipped with a protective film and sensors for real-time pressure and height control, allowing independent operation and rapid replacement, and a passage for fume discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a pressurizing head and laser emission unit are integrated as a single module, then the structure is simplified, but the replacement time increases and productivity decreases when the pressurizing head is damaged
Solution Approach 1:
The pressurizing head is divided into separate components: the pressurizing unit and the laser emission unit. This segmentation allows the pressurizing unit to be replaced independently without affecting the laser emission unit, thereby reducing replacement time and improving productivity while maintaining structural simplicity through modular design.
2Productivity
If multiple heated heads are used to bond multiple semiconductor chips simultaneously, then productivity increases, but the apparatus price rises considerably
Solution Approach 1:
The patent replaces the mechanical heated head system with a laser-based heating system. Instead of using multiple physical heated heads to bond multiple chips simultaneously, a single laser emission unit can emit laser beams to multiple bonding positions, achieving high productivity without the need for multiple expensive heated heads, thereby reducing apparatus cost while maintaining bonding speed.
3Productivity
If fumes are generated during laser bonding, then the bonding process is complete, but the fumes stick to the pressurizing object causing burning and reduced durability
Solution Approach 1:
The patent extracts the harmful fumes from the bonding area by providing a fume discharge passage in the pressurizing unit. This allows fumes to be removed during the bonding process, preventing them from sticking to the pressurizing object and causing burning, thereby maintaining pressurizing object durability while completing the bonding process efficiently.
Solution Approach 2:
The patent introduces a protective film as an intermediary between the laser emission unit and the bonding object. This protective film prevents fumes from directly contacting and sticking to the pressurizing object, thereby protecting the pressurizing object from burning and extending its durability while allowing the bonding process to proceed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces tact time, enhances productivity, prevents fume sticking, and increases the durability of the pressurizing unit, while maintaining precise pressure and height control to improve bonding quality and reduce defects.
Implementation Method 1
a laser emission unit configured to emit laser to the bonding object by converting the laser to the form of a surface light source
Implementation Method 2
emitting laser to a bonding object for a few seconds while pressurizing the bonding object
Implementation Method 3
a beam transmission plate configured to apply pressure to the bonding object, the beam transmission plate being independently and separately mounted from the laser emission unit and being made of a material transmitting a laser beam
Data Source
AI summary
A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.