Laser-Releasable Adhesive for Microelectronics Debonding
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Solution Overview
Problem
Conventional temporary bonding methods in microelectronic manufacturing face challenges such as early debonding due to heat sensitivity, solvent resistance issues, and residual glue corrosion, which complicates the processing and packaging of microelectronic structures.
Innovation Solution
A temporary bonding method utilizing a sacrificial layer composed of an alkali-soluble polymer, specifically polyamic acid, polyimide, or polyamideimide, which is removable using an alkaline aqueous solution, allowing for effective separation of substrates and minimizing component corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If UV debonding glue or thermal debonding glue is used for temporary bonding, then the bonding process can be implemented, but the heat resistance temperature is limited to about 120-150°C and cannot withstand temperatures up to 260°C
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive layer by using a specific copolymer comprising units derived from caprolactone and glycolide in a weight ratio of 95:5 to 50:50, which enables the adhesive to maintain stability at temperatures up to 260°C while retaining controlled debonding capability
Solution Approach 2:
The patent employs a composite polymer structure combining caprolactone units (providing flexibility and lower glass transition temperature) with glycolide units (providing strength and higher thermal stability), creating a material that balances heat resistance with controlled debonding properties
2Adaptability or versatility
If solvent debonding glue is used for temporary bonding, then the bonding process can be implemented, but the solvent resistance is poor and has limitations in manufacturing processes
Solution Approach 1:
The patent changes the chemical structure by using hydrolytically degradable polyester units that can be selectively removed by alkaline aqueous solutions, providing both manufacturing compatibility and controlled removal capability without poor solvent resistance issues
3Reliability
If laser debonding is used for temporary bonding, then better heat resistance and chemical resistance are achieved, but residual glue is produced during debonding that needs to be removed with high-polarity solvents, causing corrosion to other materials
Solution Approach 1:
The patent changes the chemical composition to use alkaline-soluble polymer units that can be completely removed by alkaline aqueous solutions, eliminating the need for high-polarity solvents and preventing corrosion of other materials while maintaining laser debonding capability
Solution Approach 2:
The patent designs the adhesive layer as a temporary sacrificial material that is intentionally made removable by alkaline solutions, allowing complete elimination of residual glue without damaging other components, treating the adhesive as a disposable element in the manufacturing process
4Reliability
If conventional adhesive layers are used for temporary bonding, then the bonding process can be implemented, but early debonding reaction occurs due to ambient environment influence
Solution Approach 1:
The patent changes the chemical structure by incorporating specific copolymer units with controlled glass transition temperatures and hydrolytic stability, enabling the adhesive to maintain bonding stability in ambient conditions while allowing controlled debonding at higher temperatures or with alkaline treatment
Solution Approach 2:
The patent designs the adhesive layer with preliminary chemical structure that prevents early debonding by using stable polyester units resistant to ambient moisture and temperature, while maintaining the capability for controlled removal when exposed to alkaline aqueous solutions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a reliable and efficient way to remove residual glue with an alkaline solution, reducing the risk of component corrosion and enhancing the processing robustness for microelectronic structures, while maintaining good heat and chemical resistance.
Implementation Method 1
applying laser energy to the sacrificial layer to facilitate separation of the first substrate from the second substrate
Implementation Method 2
applying laser energy to the sacrificial layer to facilitate separation
Implementation Method 3
washing the adhesive layer with an alkaline aqueous solution to remove the sacrificial layer remaining on a surface of the adhesive layer
Implementation Method 4
the sacrificial layer is formed by a composition comprising an alkali-soluble polymer
Data Source
AI summary
The present invention provides a temporary bonding method comprising: providing a stack comprising: a first substrate, an adhesive layer, a second substrate, and a sacrificial layer; and applying laser energy to the sacrificial layer to facilitate separation of the first substrate from the second substrate. The sacrificial layer in this invention is soluble in alkaline aqueous solution and therefore if there is a residual sacrificial layer, it can be easily removed with an alkaline aqueous solution to avoid damaging the component.