Laser-Releasable Inorganic Separating Layer for Carrier Substrates
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Solution Overview
Problem
Existing methods for separating carrier substrates from product substrates in the semiconductor industry face challenges such as contamination from organic polymer layers, high energy requirements for separation, and limitations in temperature resistance, which complicate the debonding and transfer processes.
Innovation Solution
The method involves using an inorganic separating layer that acts as both a bonding and a separating layer, which is irradiated with laser beams to reduce its adhesive properties, allowing for the easy and clean separation of the carrier substrate from the product substrate without the need for organic layers or high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic polymer layers are used as bonding layers for temporary adhesion, then the bond can be released without destruction, but contamination increases and additional cleaning steps are required
Solution Approach 1:
The patent changes the material parameter from organic polymer to inorganic material (such as silicon oxide). The inorganic separating layer can be selectively removed by chemical etching or laser irradiation, providing the necessary releasable bond without the contamination issues of organic polymers. This parameter change eliminates carbon-based contamination while maintaining the temporary bonding function.
Solution Approach 2:
The patent extracts the harmful organic polymer material from the system and replaces it with an inorganic separating layer. This extraction removes the source of contamination while preserving the essential function of temporary adhesion and controlled release, thereby improving cleanliness without sacrificing bond reliability.
2Ease of operation
If chemical action is applied to reduce adhesive force for separation, then mechanical separation is enabled, but energy requirement and processing complexity increase
Solution Approach 1:
The patent replaces chemical etching processes with laser irradiation for removing the separating layer. The laser provides localized energy that directly breaks the bonds in the inorganic separating layer, enabling mechanical separation without the need for chemical solutions. This substitution reduces energy consumption compared to prolonged chemical processing while maintaining ease of operation.
Solution Approach 2:
The patent employs pulsed laser irradiation to remove the separating layer in controlled intervals. This periodic action allows for precise control of the separation process, enabling mechanical separation with reduced total energy input compared to continuous chemical etching, while maintaining ease of operation through automated pulsing sequences.
3Strength
If full area polymer coating is used for bonding, then good adhesion is achieved, but separation requires acting upon the whole area making the process more complex
Solution Approach 1:
The patent applies the separating layer only in specific local areas (such as at the edges or in patterned regions) rather than coating the entire surface. This local application maintains sufficient adhesion strength in the bonding areas while enabling simplified separation by targeting only the localized separating layer regions, thereby reducing process complexity without sacrificing adhesion.
Solution Approach 2:
The patent segments the separating layer into discrete regions rather than using a continuous full-area coating. This segmentation allows the separating layer to provide adequate adhesion at interfaces while enabling selective removal in specific segments, simplifying the separation process and reducing overall complexity compared to manipulating a complete full-area layer.
4Reliability
If solvents or ultrasound are used for polymer removal, then separation is achieved, but solvent requirement and environmental impact increase
Solution Approach 1:
The patent replaces solvent-based chemical removal with laser irradiation for eliminating the separating layer. This substitution eliminates the need for large volumes of solvents while achieving reliable separation. The laser energy directly ablates or transforms the inorganic separating layer material, providing effective separation without solvent consumption and reducing environmental impact.
Solution Approach 2:
The patent utilizes phase transitions of the inorganic separating layer material under laser irradiation (such as melting, vaporization, or decomposition) to achieve separation. This phase change mechanism eliminates the need for solvents that would otherwise be required to dissolve or carry away organic polymer materials, thereby reducing solvent requirements and environmental impact while maintaining reliable separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces contamination, lowers energy input, and allows for processing at higher temperatures, enabling more efficient and flexible substrate separation and transfer processes while maintaining the integrity of the semiconductor components.
Implementation Method 1
Irradiation of the separating layer with laser beams of a laser unit
Implementation Method 2
the separating layer is inorganic and absorbs laser radiation
Data Source
AI summary
The invention relates to a method and a substrate system for the separation of a carrier substrate from a substrate, in particular a product substrate, by irradiation of the separating layer.