Laser Release Composition for Clean Wafer Peeling After CVD
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing adhesive layers for semiconductor substrates lack sufficient durability, thermal stability, and ease of peeling, leading to contamination and reduced productivity in semiconductor processing.
Innovation Solution
A laser release composition with a hydroxyphenyltriazine skeleton and organopolysiloxane structure, which facilitates bonding, withstands thermal processing, and allows facile peeling without contamination, using a laminate structure with a curable silicone resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an organic resin film tape is used as a protective layer during grinding, then flexibility is improved, but strength and heat resistance are insufficient
Solution Approach 1:
The patent uses a composite structure consisting of a silicon substrate bonded to a support substrate through an adhesive layer. This composite provides both the flexibility needed for protection during grinding and the strength and heat resistance required for subsequent processing steps, resolving the contradiction between protection capability and material strength.
2Strength
If a silicone pressure-sensitive adhesive is used for bonding, then bonding capability is achieved, but peeling time is excessively long due to chemical dissolution requirements
Solution Approach 1:
The patent replaces the chemical dissolution process with a mechanical peeling process. The adhesive layer is designed to allow simple mechanical separation of the substrates without requiring chemical treatments, dramatically reducing peeling time while maintaining adequate bonding capability during processing.
3Loss of time
If light irradiation is used to decompose the adhesive layer for peeling, then processing time is reduced, but metal contamination occurs and decomposed adhesive may re-adhere to the substrate
Solution Approach 1:
The patent eliminates the light irradiation step entirely by designing an adhesive layer that can be peeled through simple mechanical means. This substitution avoids all the harmful effects of light decomposition including metal contamination from light-absorbing substances and the problem of decomposed adhesive re-adhering to the substrate.
4Reliability
If a temporary adhesive layer with sufficient durability is used to withstand thermal processing, then bonding reliability is improved, but ease of peeling is reduced
Solution Approach 1:
The patent designs the adhesive layer with specific compositional parameters that create a dual-state behavior: at processing temperatures, the adhesive maintains strong bonding through controlled thermal stability, while at peeling conditions, the bonding strength is reduced to allow easy separation. This parameter optimization resolves the contradiction between bonding durability and peeling ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances substrate processing productivity by enabling easy peeling and resistance to thermal processes like CVD, while maintaining substrate cleanliness.
Implementation Method 1
a compound (I) having a hydroxyphenyltriazine skeleton with a maximum absorption wavelength (λmax) in a wavelength range of 300 nm to 500 nm
Data Source
Figure 1
AI summary
The present invention is a laser release composition comprising a compound (I) having a hydroxyphenyltriazine skeleton with a maximum absorption wavelength (Amax) in a wavelength range of 300 nm to 500 nm. Thus, the present invention provides a laser release composition configured to facilitate bonding between a support and a substrate, enable a heavily stepped substrate to be formed with a uniform film thickness, exhibit high compatibility with steps of forming a TSV and forming a wiring on the back surface of a wafer, have excellent resistance to wafer thermal processing such as chemical vapor deposition (CVD), allow for facile peeling of the substrate from the support, and enable removal of resin without contaminating the substrate, thereby enhancing the productivity of thin substrates.