Automated Laser Repair of Post Passivation Interconnect Defects
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Solution Overview
Problem
Defects in post passivation interconnect (PPI) layers of semiconductor devices can lead to poor device performance, shorts, or opens, and decreased yields due to undesired patterns in metal layers during the manufacturing of 2D or 3D ICs, necessitating improved defect detection and management methods.
Innovation Solution
A novel defect inspection and repairing method that uses an inspection unit to scan and analyze the PPI layer, generating a repairing recipe for a laser beam to automatically correct defects by combining lasers of different wavelengths and intensities for precise metal line cutting and redistribution, thereby isolating bridged or isolating conductive traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual inspection and repair methods are used for PPI layer defects, then flexibility and adaptability are maintained, but human error increases and repair time is excessive
Solution Approach 1:
The patent replaces manual mechanical inspection and repair operations with an automated optical system. The inspection unit uses optical scanning to detect defects, and the repair unit uses laser beams to perform repairs, eliminating human manual operations and significantly reducing repair time while maintaining high precision through automated image analysis.
Solution Approach 2:
The system performs self-inspection and self-repair operations. The inspection unit automatically scans and identifies defects, the controller automatically generates repair recipes based on defect analysis, and the repair unit automatically executes repairs without human intervention, enabling the system to service itself.
2Productivity
If automated laser repair is implemented, then repair speed and consistency are improved, but system complexity increases
Solution Approach 1:
The patent combines the inspection unit, controller, and repair unit into an integrated automated system. The inspection unit and repair unit are merged into a single platform that can perform both defect detection and repair operations, while the controller merges image analysis and repair recipe generation functions, reducing overall system complexity despite the automation capabilities.
Solution Approach 2:
The system is designed with multi-functional capabilities where the inspection unit can detect various types of defects, the controller can generate different types of repair recipes, and the repair unit can perform multiple repair operations using different laser parameters, making the system universally applicable to various defect scenarios.
3Manufacturing precision
If multiple laser wavelengths and intensities are used for precise repair, then repair precision is improved, but process complexity and energy consumption increase
Solution Approach 1:
The patent applies different laser wavelengths and intensities to different local regions or defect types. The controller analyzes the defect characteristics and generates repair recipes with specific laser parameters tailored to each defect's location, size, and type, using higher energy only where necessary for precise repair while conserving energy in other areas.
Solution Approach 2:
The system dynamically changes laser parameters including wavelength and intensity based on the defect characteristics. The controller adjusts these parameters to optimize repair precision for different defect scenarios, using parameter optimization to achieve high precision while minimizing unnecessary energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces human error and time required for defect repair, mitigating yield loss and cost by enabling automated, precise correction of defects in PPI layers, enhancing the reliability and efficiency of 2D or 3D IC production.
Implementation Method 1
generating a recipe of a beam according to the defect information, wherein the beam is configured to apply on the disposed layer
Data Source
AI summary
A defect inspection and repairing method is disclosed. The method includes: providing a wafer including a semiconductor chip disposed on a surface of the wafer; disposing a layer over the semiconductor chip; obtaining a scanned image of the disposed layer; performing an image analysis upon the scanned image to obtain a defect information; and generating a recipe of a beam according to the defect information, wherein the beam is configured to apply on the disposed layer. Associated system and non-transitory computer-readable medium are also disclosed.