Laser Processing Resin Frame for Radiation Detector

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Solution Overview

Problem

The existing process for producing radiation detectors with a scintillator layer and resin frame is inefficient due to the need for skilled cutting techniques, which hinders the reduction of device size and effective area, and increases production costs.

Innovation Solution

A radiation detector design where the protection film on the resin frame is processed using a laser beam, allowing for accurate cutting without requiring proficient techniques, enabling a smaller resin frame and increased effective area of the scintillator layer while minimizing adverse effects on the scintillator and bonding pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the resin frame is made smaller and positioned closer to the scintillator layer to maximize effective area, then the device size is reduced and effective area increases, but the cutting process becomes more difficult and requires higher proficiency

Engineering Contradiction:
Improveeffective area of scintillator layerVSAvoidcutting process difficulty
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent replaces the mechanical cutter-based cutting process with a laser beam processing system. The laser beam precisely processes the protection film and resin frame without requiring manual skill or proficiency, thereby resolving the contradiction between maximizing effective area (smaller resin frame) and ease of manufacture (cutting difficulty).

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Area of stationary object

If the resin frame is made smaller to reduce device size, then the effective area of the scintillator layer increases, but productivity decreases due to the need for skilled manual cutting

Engineering Contradiction:
Improveeffective area of scintillator layerVSAvoidproduction efficiency
Core Design Contradiction:
Area of stationary objectVSProductivity

Solution Approach 1:

The patent replaces manual mechanical cutting with automated laser beam processing, eliminating the need for skilled workers and significantly improving productivity. This allows the resin frame to be made smaller without compromising production efficiency.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the processing method from mechanical cutting to laser processing, fundamentally altering the parameters of the manufacturing process. This enables precise processing of smaller resin frames with consistent quality, thereby improving productivity.

Inventive Principle:
Principle #35Parameter changes

3Area of stationary object

If the resin frame is positioned closer to the scintillator layer to maximize effective area, then device size is reduced, but the risk of laser beam affecting the scintillator layer increases

Engineering Contradiction:
Improveeffective area of scintillator layerVSAvoidlaser beam impact on scintillator layer
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent performs preliminary processing of the protection film with the laser beam before processing the resin frame. This preliminary action creates a buffer zone and allows for controlled energy dissipation, preventing the laser beam from adversely affecting the scintillator layer while still enabling the resin frame to be positioned close to maximize effective area.

Inventive Principle:
Principle #10Preliminary action

4Manufacturing precision

If manual cutting with a cutter is used to process the protection film, then the process requires high proficiency and precision, but productivity is reduced and production cost increases

Engineering Contradiction:
Improvecutting precisionVSAvoidproduction efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces manual mechanical cutting with automated laser beam processing, which inherently provides high precision without requiring skilled operators. This substitution simultaneously improves manufacturing precision and increases productivity while reducing production costs.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the size of the radiation detector, increases the effective area of the scintillator layer, and improves productivity by simplifying the cutting process and reducing production costs.

Implementation Method 1

the outer edge of the protection film and a corresponding region of the resin frame corresponding to the outer edge of the protection film are in a processed state with a laser beam

Methodology Applied
Scientific EffectLaser beam processing: Laser

Implementation Method 2

a scintillator layer stacked on the photoelectric conversion element array so as to cover the light receiving unit and configured to convert radiation into light

Methodology Applied
Scientific EffectScintillation: Scintillation

Data Source

PatentUS11506799B2Radiation detector, and method for producing radiation detector
Publication Date: 2022.11.22 HAMAMATSU PHOTONICS KK
  • US11506799B2 patent drawing
  • US11506799B2 patent drawing
  • US11506799B2 patent drawing

AI summary

A radiation detector has a photoelectric conversion element array having a light receiving unit and a plurality of bonding pads; a scintillator layer stacked on the photoelectric conversion element array; a resin frame formed on the photoelectric conversion element array so as to pass between the scintillator layer and the bonding pads away from the scintillator layer and the bonding pads and so as to surround the scintillator layer; and a protection film covering the scintillator layer and having an outer edge located on the resin frame; a first distance between an inner edge of the resin frame and an outer edge of the scintillator layer is shorter than a second distance between an outer edge of the resin frame and an outer edge of the photoelectric conversion element array; the outer edge and a groove are processed with a laser beam.