Laser Joining of Resin Layers to Metal in Multi-Material Assemblies
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Solution Overview
Problem
Joining different materials, such as resin and metal, is challenging due to their inherent physical and chemical property differences, leading to complex production processes and increased costs, especially when heterojunction materials are involved.
Innovation Solution
A method involving a metal substrate with etched grooves and burrs, where a first resin layer with specific light transmittance and a second resin layer are laminated, and the surface of the second resin layer is irradiated with a laser to achieve simultaneous bonding of resin layers and a metal substrate, utilizing lasers with controlled parameters to enhance bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive bonding or mechanical tightening is used to join different materials, then the joining process is relatively simple, but the junction between different materials is directly exposed to the outside
Solution Approach 1:
The patent introduces a resin layer as an intermediary material between the metal substrate and the external environment. This resin layer covers the junction area, protecting it from direct exposure while maintaining the bonding function. The laser processing method then joins the resin layer to the metal substrate, creating a protected joint structure that eliminates the vulnerability of exposed junctions.
2Reliability
If separate processes are used to join resins and join resin to metal in heterojunction materials, then each joining can be performed with appropriate methods, but the production process becomes complicated and production cost increases
Solution Approach 1:
The patent merges multiple joining operations into a single laser processing step. By positioning the resin layers and metal substrate in a specific configuration, the laser beam simultaneously processes both the resin-resin interface and the resin-metal interface, achieving both joinings in one operation. This eliminates the need for separate joining processes, simplifying the production process while maintaining joining quality.
Solution Approach 2:
The laser processing method serves multiple functions simultaneously: it acts as both the heat source for joining resin layers and the heat source for joining resin to metal substrate. This multi-functionality allows a single process to accomplish what would traditionally require multiple specialized joining operations, reducing process complexity and production cost.
3Adaptability or versatility
If conventional joining methods are used for heterojunction materials, then material compatibility can be addressed, but the number of process steps increases and production cost increases
Solution Approach 1:
The patent utilizes changes in optical parameters (light absorption characteristics) of different materials to achieve selective heating and joining. The metal substrate and resin layers have different light absorption properties at the laser wavelength used, allowing the laser energy to be selectively absorbed at different depths and interfaces. This parameter-based differentiation enables the laser to simultaneously join different material combinations without requiring separate processes for each material pair, thereby maintaining material compatibility while improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the joining process, achieves excellent bonding strength between the metal substrate and resin layers, and reduces production costs by minimizing the number of process steps and avoiding environmental hazards associated with conventional methods.
Implementation Method 1
irradiating the surface of the second resin layer with a laser, wherein the first resin layer has a light transmittance of 20% to 70% at any one wavelength selected from the range of 800 nm to 1,100 nm, and the light transmittance of the first resin layer at any one wavelength selected from the range of 800 nm to 1,100 nm is lower than the light transmittance of the second resin layer at the same wavelength
Data Source
AI summary
The present invention provides a method for producing a joined body of different materials, which may easily achieve joining between a plurality of resin layers and joining between a resin and a metal, and a joined body of different materials.