Selective Laser Rework for Electronic Element Bonding Stress
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Solution Overview
Problem
The vacuum adsorption process used in manufacturing electronic devices often results in increased thermal stress due to differences in thermal expansion coefficients between lower and upper elements.
Innovation Solution
A method for manufacturing electronic devices that involves mapping good and defective elements on a substrate, using a first transparent structure with a first adhesive layer to selectively cure and separate defective elements with ultraviolet light, and then using a second transparent structure with a second adhesive layer to bond new elements to the substrate with infrared light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If vacuum adsorption process is used to manufacture electronic devices, then elements can be bonded to substrate, but thermal stress increases due to difference in thermal expansion coefficient between lower element and upper element
Solution Approach 1:
The patent extracts and removes defective elements from the substrate using a laser beam that selectively heats and separates the defective element from the substrate, eliminating the source of thermal stress problems while preserving good elements
Solution Approach 2:
The patent changes the bonding method from vacuum adsorption to laser-based selective bonding, altering the physical parameters of the bonding process to reduce thermal stress by using localized heating rather than global vacuum conditions
2Reliability
If defective elements are replaced with new elements, then device reliability improves, but manufacturing time and complexity increase
Solution Approach 1:
The patent merges the defect detection, defective element removal, and new element bonding operations into a single integrated manufacturing process, where mapping, separation, and bonding are performed sequentially in one workflow, reducing overall process complexity
Solution Approach 2:
The patent replaces manual or mechanical defect removal and element replacement processes with automated laser-based separation and bonding, substituting complex mechanical operations with precise optical control to simplify the manufacturing process
3Productivity
If selective laser light is used to separate defective elements, then productivity improves by efficient replacement, but energy consumption increases
Solution Approach 1:
The patent applies laser energy locally only to defective elements identified through mapping, rather than treating the entire substrate uniformly, concentrating energy where needed to maximize productivity while minimizing overall energy consumption
Solution Approach 2:
The patent uses partial action by selectively applying laser energy only to the extent necessary for separating defective elements and bonding new elements, avoiding excessive energy application to areas that do not require processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves productivity by efficiently replacing defective elements with new ones, reducing thermal stress and enhancing the manufacturing process efficiency.
Implementation Method 1
selectively providing ultraviolet light to the defective elements to fix the defective elements to the first transparent structure by the first adhesive layer
Implementation Method 2
selectively providing ultraviolet light or infrared light to the new elements to bond the new elements to the substrate
Data Source
AI summary
Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.