Laser-Roughened Support Surface for Lithography Anti-Sticking
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Solution Overview
Problem
In lithographic processes, the sticking of objects to surfaces during the manufacturing of integrated circuits and other devices is a challenge due to van der Waals forces, which can cause damage and hinder the manufacturing process.
Innovation Solution
A method is introduced to reduce sticking by controlling a light source to ablate a native surface, increasing its roughness and thereby reducing the contact area between the object and the surface, using selective ablation based on the atomic structure of the surface, with the light source being adjusted for intensity and focus to achieve the desired roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a smooth surface is used to support objects in lithography, then the contact area is increased for stability, but van der Waals forces cause sticking and damage
Solution Approach 1:
The surface is engineered with non-uniform roughness characteristics - peaks and valleys at controlled scales - to create localized contact points that reduce overall adhesion while maintaining positional stability. The laser treatment creates a hierarchical surface structure where only specific regions make contact with supported objects.
Solution Approach 2:
The surface roughness parameters (amplitude and wavelength) are precisely controlled through laser processing to optimize the balance between stability and reduced sticking. By adjusting the laser energy density and scanning parameters, the surface morphology is tuned to minimize van der Waals forces while preserving mechanical support functionality.
2Object-affected harmful factors
If laser ablation is applied to increase surface roughness, then sticking is reduced, but the surface morphology becomes more complex
Solution Approach 1:
The laser is applied in a periodic scanning pattern with controlled overlap and spacing, creating regular arrays of roughened regions. This periodic treatment generates a predictable surface morphology with consistent peak-to-valley dimensions that reduce sticking while maintaining manufacturing control.
Solution Approach 2:
Traditional mechanical surface treatment methods are replaced with laser ablation, which uses optical energy to selectively remove material and create the desired roughness profile. This substitution enables more precise control over surface morphology without mechanical contact.
3Manufacturing precision
If selective ablation based on atomic structure is used, then precise roughness control is achieved, but the process complexity increases
Solution Approach 1:
The laser ablation process exploits the inherent differences in atomic structure and bonding within the substrate material to achieve selective removal. The material's own structural characteristics guide the ablation pattern, reducing the need for external masking or complex positioning systems.
Solution Approach 2:
The substrate is designed as a composite or multi-phase material with distinct regions of different ablation resistance. This allows the laser to selectively modify specific phases or grain boundaries while leaving other regions intact, achieving precise roughness control through material design rather than complex process control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased surface roughness effectively reduces the ability of objects to stick to the modified surface, minimizing damage and improving the manufacturing process by reducing van der Waals forces and contact area.
Implementation Method 1
controlling a light source to deliver light to a native surface thereby causing ablation of at least a portion of the native surface
Implementation Method 2
causing ablation of at least a portion of the native surface to increase the roughness
Implementation Method 3
the sticking of objects to surfaces during the manufacturing of integrated circuits and other devices is a challenge due to van der Waals forces
Data Source
AI summary
Methods, computer program products, and apparatuses for reducing sticking during a lithography process are disclosed. An exemplary method of reducing sticking of an object to a modified surface that is used to support the object in a lithography process can include controlling a light source to deliver light to a native surface thereby causing ablation of at least a portion of the native surface to increase the roughness of the native surface thereby forming the modified surface. The increased roughness reduces the ability of the object to stick to the modified surface.