Laser Scan Velocity Control for Semiconductor Dividing Lines
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Solution Overview
Problem
Existing laser processing techniques face inefficiencies due to the time required to accelerate and decelerate the laser beam velocity, leading to prolonged processing times when high velocities are used.
Innovation Solution
A laser processing apparatus and method that includes a control unit to set a constant velocity zone between start and end points, adjusting velocity from zero to a processing velocity and back, with the length of the zone based on the target line length, allowing efficient processing by minimizing total period and adjusting frequency and velocity accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the processing velocity is increased to complete processing in a short time, then productivity is improved, but the total processing time increases due to longer acceleration and deceleration periods
Solution Approach 1:
The processing path is segmented into three distinct zones: acceleration zone, constant velocity zone, and deceleration zone. This segmentation allows the system to optimize each phase independently, ensuring that the laser irradiation position efficiently transitions through different velocity states while minimizing total processing time.
Solution Approach 2:
The processing velocity is made dynamic rather than static. The velocity profile is adjusted in real-time based on the position within the processing path, transitioning from acceleration to constant velocity to deceleration. This dynamic velocity control optimizes the balance between processing speed and total time.
2Productivity
If the processing velocity is set too high, then productivity improves, but manufacturing precision deteriorates due to improper velocity control
Solution Approach 1:
The velocity parameter is changed dynamically throughout the processing path. By adjusting the velocity from zero to processing velocity and back to zero at appropriate points, the system maintains manufacturing precision while achieving high productivity. The constant velocity zone ensures stable processing conditions for high-quality output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and precise processing of multiple lines by optimizing velocity and frequency, reducing overall processing time and ensuring consistent quality across varying object sizes.
Implementation Method 1
a processing head including a laser light source emitting a laser beam, the processing head irradiating the laser beam to a laser irradiation position from the laser light source
Data Source
AI summary
The length (constant velocity distance) of the constant velocity zone is set according to the length of the planned dividing line in the X direction, and the processing velocity in the irradiation position scan is adjusted according to the length (constant velocity distance) of the constant velocity zone (velocity adjustment processing). Therefore, it is possible to suppress a total time (scanning time) of the acceleration period, the constant velocity period and the deceleration period. In this way, the planned dividing line can be efficiently processed in the laser processing technique for processing the planned dividing line by moving the laser beam along the planned dividing line of the semiconductor substrate.