Laser Scanner for CMP Conditioning Disk Residue Removal
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Solution Overview
Problem
Conventional chemical mechanical polishing (CMP) techniques face challenges in maintaining the effectiveness of the polishing pad due to debris accumulation, which reduces polishing performance, and lack real-time feedback for conditioning disk wear, leading to increased costs and waste.
Innovation Solution
Incorporating a laser scanner to monitor and clean the conditioning disk using short pulse or ultra short pulse lasers, allowing for real-time surface condition assessment and residue removal, thereby optimizing the conditioning process and extending the useful lifetime of the conditioning disk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional CMP techniques are used without real-time monitoring, then the polishing process is simpler and less costly, but the conditioning disk wears out faster and polishing performance deteriorates due to debris accumulation
Solution Approach 1:
The patent implements real-time feedback by using a laser scanner to continuously monitor the surface condition of the conditioning disk during CMP operation. The laser scanner detects debris accumulation and wear in real-time, providing feedback signals that trigger automatic cleaning operations or alert operators to replace the conditioning disk before performance deteriorates significantly.
Solution Approach 2:
The patent replaces manual inspection and mechanical monitoring methods with an optical laser scanning system. The laser scanner uses light interaction with the conditioning disk surface to detect debris and wear conditions, substituting complex mechanical sensing mechanisms with a non-contact optical measurement system that is both simpler and more reliable.
2Manufacturing precision
If the conditioning disk is replaced frequently to maintain polishing performance, then polishing quality is maintained, but material waste and operational costs increase
Solution Approach 1:
The patent applies preliminary action by continuously monitoring the conditioning disk surface condition before significant wear or debris accumulation occurs. The laser scanner detects early signs of degradation and triggers cleaning operations or replacement alerts in advance, preventing the conditioning disk from reaching a state where it can no longer perform its function effectively.
Solution Approach 2:
The patent implements a systematic approach to discarding and recovering by using real-time monitoring data to determine the optimal replacement timing of the conditioning disk. The laser scanner tracks wear progression, and the system maximizes the useful life of each conditioning disk by replacing it only when monitoring data indicates performance degradation below acceptable thresholds, thereby reducing waste.
3Productivity
If manual inspection of the conditioning disk is performed, then the system remains simple, but real-time monitoring is not achieved and polishing performance cannot be maintained
Solution Approach 1:
The patent implements self-service by enabling the CMP system to automatically monitor and assess its own conditioning disk condition during operation. The laser scanner is integrated into the system and autonomously scans the conditioning disk surface, detecting debris accumulation and wear without requiring external intervention or manual inspection, thereby maintaining high productivity through automated self-diagnosis.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laser scanner effectively removes debris and monitors the surface condition of the conditioning disk, maintaining polishing performance, reducing waste, and optimizing the replacement timing of the conditioning disk, thus enhancing the efficiency and cost-effectiveness of the CMP process.
Implementation Method 1
the surface of the conditioning disk is scanned to remove residue using a laser scanner
Data Source
AI summary
A method for CMP is provided. The method includes the following operations. A semiconductor wafer is received. The semiconductor wafer is polished. In some embodiments, a residue is generated during polishing the semiconductor wafer and the residue attaches to a surface of a conditioning disk disposed on a dresser head. The dresser head and the conditioning disk are moved back and forth between a refuge position and a working region by the dresser arm during polishing the semiconductor wafer. The surface of the conditioning disk is scanned to remove the residue using a laser scanner when the dresser head and the conditioning disk are in refuge position.