Laser Scanning PLD for Uniform Combinatorial Film Deposition
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Solution Overview
Problem
Existing pulsed laser deposition technologies face issues such as thermal disturbance during target material replacement, uneven film thickness distribution, and mutual contamination of multiple target materials, leading to reduced performance of combinatorial films.
Innovation Solution
An apparatus and method for pulsed laser deposition using laser scanning sputtering components with adjustable supports and a mask to control the irradiation time and direction of the laser beam, allowing precise control over film deposition and preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If target materials are replaced to deposit different components, then different materials can be deposited, but thermal disturbance occurs causing repeated annealing and reduced film performance
Solution Approach 1:
The patent divides the target material into multiple independent target pieces, each made of different materials. The laser beam can selectively irradiate different target pieces to deposit different materials without physically replacing the entire target, thus avoiding thermal disturbance and repeated annealing while maintaining the ability to deposit various materials.
Solution Approach 2:
The patent introduces a mask that can move dynamically to control which target material regions are exposed to the laser beam. By moving the mask to different positions, different target materials are selectively deposited without physical target replacement, resolving the contradiction between material versatility and thermal stability.
2Adaptability or versatility
If deposition time is controlled through mask to achieve combinatorial films, then different components are deposited on different areas, but film thickness distribution becomes uneven
Solution Approach 1:
The patent creates different deposition conditions for different regions of the substrate by using multiple target materials with different sputtering rates. Each region receives material from targets optimized for its specific requirements, allowing combinatorial film composition control while compensating for thickness non-uniformity through local optimization.
3Productivity
If multiple target materials are present simultaneously, then combinatorial films can be formed, but mutual contamination of target materials occurs
Solution Approach 1:
The patent segments the target material into separate physical pieces, each containing a different material. This spatial segmentation prevents mutual contamination between materials while allowing simultaneous presence of multiple targets for efficient combinatorial film deposition.
Solution Approach 2:
The patent introduces a mask as an intermediary element that controls the plasma plume from each target material. The mask selectively blocks or allows material transport from different targets to specific substrate regions, preventing cross-contamination while maintaining deposition efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the deposition rate and performance of single-component and combinatorial films by ensuring uniform thickness distribution and reducing thermal interference, enabling the formation of combinatorial films with gradient changes and multi-layer structures.
Implementation Method 1
Pulsed Laser Deposition (PLD) technology, as an important technique for preparing superconducting films, generates plasma in the direction normal to the target material through the interaction of the laser with the target material
Implementation Method 2
by bombarding the corresponding target materials with excimer lasers, the corresponding precursor components are sputtered
Data Source
AI summary
The present application discloses an apparatus for pulsed laser deposition and method. The device includes a laser scanning sputtering component comprising: a base; an adjustment device located on the base; multiple second supports located on the adjustment device and extending in the third direction; a first support located on the multiple second supports. The adjustment device adjusts the second supports and the first support to move in the first direction and/or the second direction, the first direction, the second direction, and the third direction being mutually perpendicular. The apparatus for pulsed laser deposition and method provided by the present disclosure enable precise control of the irradiation time of the laser beam on the target material surface through the laser scanning sputtering component, thereby not only improving the rate for depositing a film but also enhancing the performance of a single-component film and a combinatorial film.