Laser Scribing and Plasma Dicing Element Chips
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Solution Overview
Problem
The plasma-dicing process is adversely affected by undesired material adhered on the streets during the laser-scribing step, which can lead to processing quality issues due to debris and ridges formed by the pulsed laser beam, complicating the subsequent plasma etching step.
Innovation Solution
A multi-phase laser scribing process is implemented, including first and second shallow-groove formation steps, and a first groove formation step, to progressively form grooves along the substrate's streets, reducing the amount of undesired material and minimizing its impact on the plasma etching process by repeated laser beam radiation, allowing for efficient removal of debris and ridges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a pulsed laser beam is used in the laser-scribing process to suppress thermal impact, then thermal damage is reduced, but undesired material (debris) scatters and adheres on the streets, adversely affecting plasma etching quality
Solution Approach 1:
The laser scribing process is divided into multiple passes (first pass, second pass, and optional third pass) with progressively increasing energy. The first pass creates initial grooves with lower energy to minimize debris, while subsequent passes deepen the grooves with higher energy to complete the scribing, thereby reducing overall debris generation and adhesion
Solution Approach 2:
The first laser scribing pass performs preliminary grooving at lower energy levels before the final high-energy pass. This preliminary action prepares the substrate by creating initial grooves that guide the subsequent high-energy pass, reducing the total debris generated compared to using high energy from the start
2Productivity
If mechanical cutting is used to remove the rest portion through the substrate, then dicing is completed, but undesired material adhered on the streets causes substantial adverse impact on processing quality
Solution Approach 1:
The mechanical cutting blade is replaced with a plasma etching process that uses plasma to remove material. This substitution eliminates the mechanical contact that generates debris and ridges, thereby improving processing quality while maintaining productivity. The plasma process selectively etches the substrate along the laser-scribed grooves without adhering undesired material
3Productivity
If plasma etching is used to dice the substrate, then dicing is achieved, but undesired material adhered on the streets from laser scribing causes adverse impact on processing quality
Solution Approach 1:
The laser scribing process is segmented into multiple passes with increasing energy levels. The first pass uses lower energy to create initial grooves with minimal debris, while subsequent passes use higher energy to complete the grooves. This segmentation reduces the total amount of undesired material that would otherwise interfere with plasma etching quality
Solution Approach 2:
The laser beam energy parameters are changed between passes, starting with lower energy in the first pass and increasing to higher energy in subsequent passes. This parameter change optimizes the balance between groove formation efficiency and debris generation, ensuring that the substrate is prepared for plasma etching with minimal undesired material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the processing quality of the plasma etching step by reducing the amount of undesired material, thereby improving the accuracy and efficiency of the dicing process into element chips.
Implementation Method 1
a laser scribing step for radiating a laser beam to the first side along the first and second streets to form a plurality of first and second grooves along the streets
Implementation Method 2
a plasma dicing step for etching the rest of the substrate remaining in a direction of a depth along the first and second grooves through the substrate by a plasma exposure to the grooves
Data Source
AI summary
A manufacturing process of an element chip comprises a preparation step for preparing a substrate, the substrate including first and second streets crossing each other to define a plurality of element regions. Also, it comprises a first shallow-groove formation step for radiating a laser beam along the first streets to form a plurality of first shallow grooves being shallower than a thickness of the substrate, a second shallow-groove formation step for radiating the laser beam along the second streets to form a plurality of second shallow grooves being shallower than a thickness of the substrate, a first groove formation step for radiating the laser beam along the first shallow grooves to form a plurality of first grooves, and a plasma dicing step for etching the substrate along the first grooves and the second shallow grooves by a plasma exposure to dice the substrate into a plurality of element chips.