Laser-Sealed Vacuum Package With Getter For Thermal Sensors
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Solution Overview
Problem
Conventional vacuum encapsulating packages face challenges such as high manufacturing costs due to the need for expensive vacuum apparatuses, low productivity, and difficulty in maintaining a consistent vacuum level over time, particularly when sealing through holes and integrating getters for thermal type infrared ray sensors.
Innovation Solution
The solution involves a package design where through holes are sealed by locally heating a low-melting point material, such as Sn or its alloys, using a laser beam to block the holes quickly and efficiently, and incorporating a getter material to maintain the vacuum, eliminating the need for complex vacuum apparatuses and high-cost manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vacuum sealing methods are used to seal through holes, then vacuum integrity is achieved, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent utilizes the phase transition of low-melting-point material from solid to liquid state through localized heating. The low-melting-point material (melting point 100-500°C) is heated by a laser beam to melt and seal the through hole, then solidifies to maintain the seal. This phase transition enables effective sealing at lower temperatures compared to conventional methods, reducing manufacturing costs while maintaining vacuum integrity.
Solution Approach 2:
The patent replaces complex mechanical vacuum sealing apparatuses with a simplified laser-based heating system. Instead of using expensive vacuum equipment and mechanical sealing mechanisms, the invention uses a laser beam to locally heat and melt the low-melting-point material, achieving sealing through thermal processing. This substitution dramatically reduces equipment complexity and manufacturing costs.
2Reliability
If conventional vacuum sealing methods are used to seal through holes, then vacuum integrity is achieved, but manufacturing time increases
Solution Approach 1:
The rapid phase transition of low-melting-point material enables quick sealing. The material melts rapidly under laser heating and solidifies quickly after heating stops, completing the sealing process in a short time. This rapid phase change significantly reduces manufacturing time compared to conventional vacuum sealing methods while ensuring reliable vacuum integrity.
Solution Approach 2:
The laser heating process operates in a periodic manner - the laser beam is applied to heat the low-melting-point material, then stopped to allow solidification. This periodic heating and cooling cycle enables rapid sealing without requiring prolonged processing time, thereby improving productivity while maintaining seal quality.
3Temperature
If low-melting-point material is used for sealing, then sealing temperature is reduced, but material selection becomes more specific
Solution Approach 1:
The patent changes the key parameter of sealing temperature by selecting materials with low melting points (100-500°C). This parameter change enables sealing at lower temperatures, preventing damage to heat-sensitive electronic devices. The low-melting-point material melts and solidifies at controlled temperatures, providing effective sealing without requiring high-temperature processes.
Solution Approach 2:
The low-melting-point material is applied locally at the through hole region rather than throughout the entire package. This localized application allows the material to perform its specific sealing function at the hole location while the rest of the package structure can use different materials optimized for their respective functions. The local quality approach maintains versatility in overall material selection while achieving low-temperature sealing where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, enhances productivity, and ensures long-term vacuum integrity by simplifying the sealing process and utilizing a getter to absorb gas molecules, thereby maintaining the package's sensitivity and reliability.
Implementation Method 1
through holes are sealed by locally heating a low-melting point material, such as Sn or its alloys, using a laser beam to block the holes
Implementation Method 2
locally heating a low-melting point material, such as Sn or its alloys, using a laser beam to block the holes
Implementation Method 3
incorporating a getter material to maintain the vacuum, eliminating the need for complex vacuum apparatuses
Data Source
AI summary
The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.