Laser Workpiece Separation for Uniform Peeling on Curved Laminates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing workpiece-separating devices face challenges in uniformly irradiating laser beams onto curved or deformed laminated bodies, leading to irregular peeling, partial peeling failures, and potential damage to circuit boards due to non-uniform energy distribution and excessive irradiation.
Innovation Solution
A workpiece-separating device with a holding member, a light irradiation part equipped with a laser scanner, and a controlling part that moves the light irradiation position relative to the laminated body, dividing the separating layer into smaller irradiation areas and aligning spot-like laser beams to ensure uniform irradiation across the entire surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser beams are irradiated onto a curved or deformed laminated body, then the separating layer can be altered and peeling can occur, but the irradiation becomes non-uniform leading to partial peeling failures and potential damage to circuit boards
Solution Approach 1:
The patent divides the laminated body into multiple irradiation areas and irradiates each area separately with controlled laser beams. This segmentation allows uniform energy distribution across the entire surface even when the workpiece is curved or deformed, preventing both under-irradiation (peeling failure) and over-irradiation (circuit board damage).
Solution Approach 2:
The patent employs a laser scanner to dynamically adjust the irradiation position and a holding member to correct the curvature of the laminated body before irradiation. This dynamic adjustment ensures that laser beams remain focused and uniformly distributed on the separating layer regardless of initial workpiece deformation.
2Productivity
If the entire separating layer is irradiated at once, then peeling efficiency is high, but it is extremely difficult to uniformly perform irradiation on large or curved surfaces
Solution Approach 1:
The separating layer is divided into multiple irradiation areas that are processed sequentially. This segmentation enables precise control of laser energy distribution across large or curved surfaces while maintaining overall peeling efficiency through automated scanning and positioning systems.
Solution Approach 2:
The holding member performs preliminary action by correcting the curvature of the laminated body before laser irradiation begins. This pre-correction ensures that subsequent irradiation of divided areas achieves uniform energy distribution, enabling both high productivity and precision.
3Reliability
If laser output is increased to ensure complete peeling, then peeling reliability improves, but damage to circuit boards occurs due to excessive irradiation
Solution Approach 1:
By dividing the irradiation into multiple areas with controlled exposure, the patent achieves complete peeling through cumulative energy input rather than excessive single-dose irradiation. This prevents circuit board damage while ensuring thorough altering of the separating layer.
Solution Approach 2:
The patent applies partial irradiation to each divided area with controlled energy levels, avoiding the excessive action that would damage circuit boards. The cumulative effect of multiple controlled irradiations achieves complete peeling without harmful over-irradiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables uniform peeling of the supporting body from the workpiece without irradiation irregularities, preventing damage and ensuring high-quality separation even for large or curved workpieces, regardless of the material's properties.
Implementation Method 1
a separating layer that alterably peels due to irradiation of laser beams L when viewed from a supporting body 2 through which the laser beams L pass, to a workpiece 1 (including a circuit board)
Implementation Method 2
At the interface between the substrate and the material layer, due to irradiation of the pulsed laser beams, GaN is decomposed near the interface between the substrate and the material layer
Implementation Method 3
At the interface between the substrate and the material layer, due to irradiation of the pulsed laser beams, GaN is decomposed near the interface between the substrate and the material layer, and the material layer is peeled from the substrate
Implementation Method 4
GaN is decomposed near the interface between the substrate and the material layer
Data Source
AI summary
A workpiece-separating device includes: a holding member that detachably holds a workpiece of a laminated body in which the workpiece that includes a circuit board and a supporting body through which laser beams pass are laminated with each other via a separating layer that peelably alters due to at least absorption of the laser beams; a light irradiation part that irradiates the laser beams toward the separating layer through the supporting body of the laminated body held by the holding member; a driving part that relatively moves a light irradiation position of irradiation from the light irradiation part with respect to the supporting body and the separating layer of the laminated body held by the holding member in at least a direction crossing a light irradiation direction of irradiation from the light irradiation part; and a controlling part that operates and controls the light irradiation part and the driving part.