Liquid-Constrained Laser Shock Peening for Uniform Residual Stress

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Solution Overview

Problem

The existing laser shock peening technology often results in uneven residual stress distribution on material surfaces due to the 'residual stress hole' phenomenon, which adversely affects the material's performance.

Innovation Solution

A single-beam double-physical-effect coordinating and distributing method is introduced, which involves determining the residual stress distribution state under solid and liquid constraint conditions, adjusting the liquid constraint layer features to optimize the intensity ratio of 'plasma shock' to 'cavitation' effects, and applying these adjustments to achieve uniform laser shock peening.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If conventional laser shock peening technology is used, then high shock pressure can be generated, but uneven residual stress distribution occurs due to the 'residual stress hole' phenomenon

Engineering Contradiction:
Improveshock pressureVSAvoidresidual stress distribution uniformity
Core Design Contradiction:
ForceVSManufacturing precision

Solution Approach 1:

The patent changes the physical state of the constraint layer from solid to liquid, and adjusts liquid parameters (type, thickness, temperature) to control the plasma shock and cavitation effects. This parameter change eliminates the residual stress hole while maintaining high shock pressure, resolving the contradiction between force generation and stress distribution uniformity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite constraint system combining liquid constraint layer and absorption layer. The liquid constraint layer generates both plasma shock and cavitation effects, while the absorption layer converts laser energy to heat. This composite structure achieves uniform residual stress distribution while maintaining high shock pressure

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If liquid constraint layer is used to eliminate residual stress hole, then uniform residual stress distribution is achieved, but precise control of plasma shock and cavitation intensity ratio becomes difficult

Engineering Contradiction:
Improveresidual stress distribution uniformityVSAvoidcontrol system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent identifies key liquid constraint layer parameters (thickness, temperature, liquid type) that directly control the intensity ratio of plasma shock to cavitation effects. By adjusting these parameters, precise control is achieved without complex control systems, eliminating the contradiction between uniformity and control complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent establishes a feedback mechanism where residual stress distribution is measured and used to adjust liquid constraint layer parameters. This feedback loop enables precise control of the plasma shock and cavitation intensity ratio, resolving the contradiction between uniformity achievement and control simplicity

Inventive Principle:
Principle #23Feedback

3Manufacturing precision

If multiple processing parameters are adjusted to achieve uniform peening, then processing quality improves, but processing time and complexity increase

Engineering Contradiction:
Improvepeening uniformityVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent identifies the liquid constraint layer parameters (thickness, temperature, type) as the key control variables that directly affect peening uniformity. By focusing adjustment on these few critical parameters rather than multiple parameters, the patent achieves uniform peening quickly, resolving the contradiction between quality and processing time

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively minimizes the 'residual stress hole' effect by systematically setting absorption layer feature parameters, allowing for mass production of laser shock peening technologies that uniformly distribute residual stress, enhancing material performance.

Implementation Method 1

Pulse laser will lead to plasma explosion on a surface of a material, so as to form GPa order of magnitude of shock pressure

Methodology Applied
Scientific EffectLaser-induced plasma explosion: Laser Ablation

Implementation Method 2

a phenomenon of 'residual stress hole' always occurs on a surface of a target material... uniform peening or modification of the surface of the material is achieved through distribution of an occurring intensity of these two physical effects

Methodology Applied
Scientific EffectCavitation: Cavitation

Data Source

PatentUS20220266391A1Single-beam double-physical-effect coordinating and distributing method applicable to uniform laser shock and application thereof
Publication Date: 2022.08.25 SHANDONG UNIV
  • US20220266391A1 patent drawing

AI summary

The present invention provides a single-beam double-physical-effect coordinating and distributing method applicable to uniform laser shock and application thereof, and belongs to the technical field of laser shock effect control. The present invention does not stipulate the specific adjusting and distributing mean, and only provides a coordinating principle and method. The present invention gives a universal and systematic method for setting absorption layer feature parameters applicable to mass laser shock uniform peening under a liquid constraint condition, so as to facilitate the relevant technician to quickly obtain the liquid constraint laser shock processing technology conforming to a distribution proportion of its double physical effects, thereby being beneficial to development and application of the laser shock peening treatment, and therefore having the good actual application value.