Laser Singulation of Adhesive Foil for Semiconductor Devices

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Solution Overview

Problem

Conventional methods for applying adhesive foil to semiconductor devices are inefficient, requiring frequent cleaning and replacement of punch tools, leading to downtime and glue residue issues, and are limited to circular shapes, which can result in poor adhesion and contamination.

Innovation Solution

A method using a laser to singulate adhesive foil portions covering target regions on semiconductor devices, allowing for efficient application and cutting of various shapes without the need for frequent tool maintenance, enabling simultaneous application to multiple devices and reducing glue residue.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If stamping or punching is used to cut adhesive foil, then adhesive foil pieces can be applied to semiconductor devices, but glue accumulates on punch tools requiring frequent cleaning and replacement

Engineering Contradiction:

Improveadhesive foil applicationVSAvoidtool cleaning and replacement downtime

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The patent replaces the mechanical stamping/punching system with a laser-based system. The laser singulates the adhesive foil without physical contact, eliminating glue accumulation on tools and the associated cleaning downtime while maintaining the ability to cut precise shapes for semiconductor device application.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention extracts the cutting function from the mechanical punch tool and transfers it to a laser beam. This separation allows the adhesive application process to continue without interruption for tool maintenance, as the laser requires no cleaning or replacement.

Inventive Principle:

Principle #2Taking out (Extraction)

2Ease of manufacture

If stamping or punching is used to cut adhesive foil, then adhesive foil pieces can be applied to semiconductor devices, but the process is slow due to sequential stamping and application requiring alignment with each device

Engineering Contradiction:

Improveadhesive foil applicationVSAvoidapplication speed

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The laser-based singulation system enables faster processing compared to mechanical stamping. The laser can rapidly cut multiple shapes without the alignment and repositioning required by mechanical punches, significantly improving application speed and productivity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If stamping or punching is used to cut adhesive foil, then adhesive foil pieces can be obtained, but glue residue remains along edges exposing devices to contamination and potentially jamming test equipment

Engineering Contradiction:

Improveadhesive foil cuttingVSAvoidglue residue contamination

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The laser cutting process produces clean edges without glue residue, eliminating the contamination risk to semiconductor devices and preventing test equipment jams. The non-contact nature of laser singulation ensures pristine cut edges that mechanical tools cannot achieve.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Ease of manufacture

If stamping or punching is used to cut adhesive foil, then circular shapes can be produced, but non-circular shapes are not properly punched reducing adhesion quality

Engineering Contradiction:

Improveadhesive foil shape cuttingVSAvoidshape accuracy and adhesion quality

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The laser system allows dynamic adjustment of cut paths to create various shapes with high precision. Unlike mechanical punches limited to fixed circular shapes, the laser can precisely singulate any shape required for optimal device coverage and adhesion quality.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces maintenance costs and downtime, improves adhesion by eliminating glue residue, and allows for efficient parallel processing of semiconductor devices with precise shape cutting, enhancing the quality and reliability of the adhesive application.

Implementation Method 1

illuminating the foil with a laser to singulate from the foil a portion covering the at least one target region of the at least one semiconductor device

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS7999362B2Method and apparatus for making semiconductor devices including a foil

Publication Date: 2011.08.16 INFINEON TECHNOLOGIES AG

AI summary

A method for manufacturing a semiconductor device including covering a portion of at least one semiconductor device with a foil, including covering at least one target region of the semiconductor device, and illuminating the foil with a laser to singulate from the foil a portion covering the at least one target region of the at least one semiconductor device.