Laser-Sintered Die Surfaces for Tailored Cooling in Hot Forming
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing hot forming processes for vehicle body components, which involve discrete heat-treating operations, are costly and time-consuming, and there is a need for a more efficient method to achieve the desired mechanical properties of strength and lightness.
Innovation Solution
A hot forming system with a die configuration that includes both high thermal conductive and low thermal conductive surfaces, where the cooling system is strategically positioned to control the cooling rate of the work piece, allowing for simultaneous forming and quenching, thereby creating regions of varying mechanical properties within the formed component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional hot forming die with uniform cooling is used, then the forming and quenching operations can be performed simultaneously, but the entire work piece is cooled at the same rate resulting in uniform mechanical properties throughout
Solution Approach 1:
The patent applies local quality by creating regions of different thermal conductivity within the die. Specifically, the die includes both conventional thermally conductive regions and thermally insulative regions (with thermal conductivity 10-100 times lower). This allows different portions of the work piece to experience different cooling rates simultaneously, producing tailored mechanical properties (hard/strong regions vs. soft/ductile regions) within a single forming operation, thereby resolving the contradiction between productivity and adaptability.
2Manufacturing precision
If discrete heat-treating operations are used after forming, then the desired mechanical properties can be achieved, but the process becomes costly and time-consuming
Solution Approach 1:
The patent merges the forming operation and heat treatment operation into a single integrated process. The die is designed with specific thermal conductivity characteristics that enable simultaneous forming and controlled cooling/heat treatment. This eliminates the need for separate post-forming heat treatment steps, reducing both processing time and operational costs while maintaining precise control over mechanical properties through the die's thermal design.
3Ease of manufacture
If water cooling passages are formed in a conventional manner, then the cooling system can be integrated into the hot forming die, but the thermal conductivity is uniform throughout the die
Solution Approach 1:
The patent employs composite materials by combining thermally conductive materials (for rapid cooling regions) and thermally insulative materials (for slow cooling regions) within the same die structure. This composite approach allows the die to exhibit spatially varying thermal conductivity, enabling different cooling rates in different regions while maintaining manufacturability through conventional die construction techniques adapted for composite structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of vehicle body components with tailored mechanical properties, such as regions of high ductility and reduced strength, while maintaining high strength and hardness in other areas, thereby optimizing material usage and processing efficiency.
Implementation Method 1
A sintered material is formed on opposing portions of the first and second die surfaces to form a relatively low thermal conductive die region
Implementation Method 2
The first die and the second die have opposing, relatively high thermal conductive surfaces to form a relatively high thermally conductive die region
Data Source
AI summary
A forming system includes a first die, a second die, and a cooling system. A sintered material is formed on opposing portions of the first and second die surfaces to form a relatively low thermal conductive die region. The first die and the second die have opposing, relatively high thermal conductive surfaces to form a relatively high thermal conductive die region. The cooling system is disposed in a thermal conductive relation with the relatively high thermal conductive surfaces. The sintered material on the opposing portions of the first and the second die surfaces cooperate to be on opposite sides of the work piece received in the die cavity. Portions of the work piece in direct contact with the sintered material are cooled at a cooling rate slower than that of portions of the work piece that are in direct contact with the relatively high thermal conductive surfaces.