Laser Sintered Underplate for Thermal Bonding

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Solution Overview

Problem

Existing bonded structures face delamination issues during elevated temperature processing due to inadequate thermal transfer and bond strength, particularly when subjected to temperatures exceeding 300°C.

Innovation Solution

A sintered interface is created using a high energy beam to deposit a metallic layer, such as nickel or copper, directly onto a structural member, forming a robust bond that withstands temperatures above 350°C without delamination, utilizing a process that avoids subjecting the member to high processing temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional deposition methods are used to form metallic layers, then manufacturing complexity is reduced, but bond strength and thermal transfer capability deteriorate at temperatures exceeding 300°C

Engineering Contradiction:

Improvebond strengthVSAvoidprocess complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical/chemical deposition methods with laser sintering technology. The laser beam directly sinters metal particles to form a metallic layer with superior bond strength and thermal transfer properties, eliminating the need for complex multi-step conventional deposition processes while achieving robust bonds that withstand temperatures above 300°C

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the processing parameters by using laser sintering at controlled temperatures to create a metallic layer with optimized microstructure. This parameter change enables the formation of a sintered interface that maintains bond strength and thermal conductivity at elevated temperatures, resolving the contradiction between process simplicity and performance

Inventive Principle:

Principle #35Parameter changes

2Reliability

If conventional bonding processes are used, then manufacturing simplicity is maintained, but thermal transfer capability and reliability deteriorate at elevated temperatures

Engineering Contradiction:

Improvebond integrityVSAvoidmanufacturing simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces conventional bonding processes with laser sintering technology, which uses a laser beam to directly sinter metal particles and form a metallic layer. This substitution creates a sintered interface with superior reliability and thermal transfer capability that maintains bond integrity at elevated temperatures, while the direct sintering process actually simplifies the manufacturing workflow

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If high processing temperatures are applied to form metallic layers, then thermal transfer capability is improved, but the structural member suffers from thermal damage

Engineering Contradiction:

Improvethermal transfer capabilityVSAvoidthermal damage

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by using laser sintering to create a localized sintered interface with enhanced thermal transfer capability. The laser beam selectively sinters metal particles only at the interface region where thermal transfer is needed, without subjecting the entire structural member to high temperatures, thus avoiding thermal damage while achieving superior thermal transfer at the bonding interface

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent introduces a metallic layer formed by laser sintering as an intermediary between the structural member and the component to be bonded. This metallic layer acts as a thermal conductor that improves thermal transfer capability, while the laser sintering process forms it at controlled temperatures that prevent thermal damage to the structural member

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sintered interface ensures continuous contact and efficient thermal conductivity, preventing blistering, cracking, and delamination, while being significantly more robust than conventional deposition methods, maintaining bond integrity and thermal fatigue resistance.

Implementation Method 1

The metallic layer 24 is deposited onto the structural member 22 using a high energy beam. The high energy beam may be a laser or an electron beam that is directed toward a target source of metal

Methodology Applied

Scientific EffectLaser deposition: Pulsed Laser Deposition

Implementation Method 2

The process of applying heat and depositing the source material in a high energy plume causes thermal consolidation of the material to form the sintered interface 30 of the metallic layer 24

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 3

continuous contact between the metallic layer 24 and the structural member 22 facilitates efficient thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9346114B2Substrate having laser sintered underplate

Publication Date: 2016.05.24 AEROJET ROCKETDYNE OF DE INC

AI summary

A substrate includes a metal portion and an underplate that is laser sintered to the metal portion. The metal portion has a melting point that is lower than a sintering temperature of the underplate.