Laser Soldering Beam Alignment for Precise Solder Ball Irradiation
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Solution Overview
Problem
Existing laser soldering methods face challenges in maintaining accurate laser irradiation positions due to external impacts, vibrations, or operator errors, leading to deteriorated soldering quality and position.
Innovation Solution
A laser soldering apparatus is designed with an adjustable laser irradiation position, incorporating a solder unit with a nozzle unit and a monitoring unit to accurately align the laser beam with the central point of the solder ball, allowing for real-time adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a preset laser irradiation position is used, then the soldering process is simple, but the irradiation position accuracy deteriorates due to external impact, vibration, or operator error
Solution Approach 1:
The patent implements a feedback mechanism where the monitoring unit detects the actual position of the solder ball, and this position information is fed back to adjust the laser irradiation position. The control unit processes the monitored position data and adjusts the laser beam position accordingly, ensuring the laser always irradiates the correct location despite external disturbances or initial positioning errors.
Solution Approach 2:
The system performs self-adjustment by automatically monitoring its own irradiation position and correcting deviations without external intervention. The monitoring unit and control unit work together to autonomously detect position errors and adjust the laser beam position, enabling the system to self-correct positioning inaccuracies caused by vibrations, impacts, or operator errors.
2Manufacturing precision
If the laser irradiation position is adjustable with monitoring and beam adjusting units, then the irradiation position accuracy is improved, but the device complexity increases
Solution Approach 1:
The patent combines the monitoring unit and beam adjusting unit into an integrated system that works together as a unified position control mechanism. The monitoring unit and beam adjusting unit are coordinated through a control unit, merging detection and adjustment functions into a cohesive system that manages complexity through functional integration rather than separate independent systems.
Solution Approach 2:
The control unit serves as an intermediary that processes information from the monitoring unit and translates it into adjustment commands for the beam adjusting unit. This intermediary layer simplifies the overall system architecture by providing a centralized processing point that coordinates between the monitoring and adjustment components, reducing the complexity of direct point-to-point connections and control logic.
3Productivity
If the optical module and image apparatus are provided together on the solder unit, then the soldering speed is improved by shortest distance, but the device complexity increases
Solution Approach 1:
The patent merges the optical module and image apparatus into a single integrated solder unit, combining multiple functional components into one unified structure. This integration reduces the physical distance between components, enabling faster signal transmission and coordination, thereby improving soldering speed while managing complexity through consolidated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus significantly improves the accuracy of laser irradiation and processing efficiency by ensuring precise alignment of the laser beam with the solder ball, resulting in enhanced soldering quality and position accuracy.
Implementation Method 1
heating and melting the solder ball by irradiating a laser beam on the surface of the solder ball
Implementation Method 2
irradiating a laser beam on the surface of the solder ball for high-accuracy and high-quality soldering
Implementation Method 3
a monitoring unit disposed on one side of the solder unit to monitor the irradiation position of the laser beam
Data Source
AI summary
The present invention provides a laser soldering apparatus and a soldering method, the laser soldering apparatus including: a solder unit for forming a bonding surface by performing the soldering by a laser beam, and comprising at least one nozzle unit for accommodating a solder ball to which the laser beam is irradiated; and a monitoring unit arranged on one side of the solder unit to monitor the irradiation position of the laser beam, wherein the irradiation position of the laser beam irradiated from the solder unit is adjusted to be irradiated to the central point of the nozzle unit or the solder ball according to the monitoring result of the monitoring unit.