Laser Soldering Spot Shaping With SLM Feedback Control
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Solution Overview
Problem
Conventional laser soldering apparatuses face challenges in adjusting spot shape and size in real-time, which hinders high-quality soldering due to the time required for switching these parameters.
Innovation Solution
A laser soldering apparatus incorporating a spatial light modulator (SLM) and a control unit that adjusts the irradiation conditions of laser light, including spot shape, size, intensity distribution, and output, based on real-time sensing data from sensors such as image, temperature, and photodetectors, allowing for dynamic control of the laser light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional mask-based or plate-shaped optical element methods are used to change spot shape, then spot shape can be changed, but it takes one second or more to switch the spot shape
Solution Approach 1:
The patent replaces mechanical mask switching or plate displacement mechanisms with a spatial light modulator (SLM) that uses optical field modulation. The SLM changes spot shape by controlling the phase or amplitude distribution of laser light through electrical signals, eliminating mechanical movement and achieving rapid shape switching without the one-second or longer delay inherent in mechanical systems.
Solution Approach 2:
The patent implements dynamic spot shape control by using an SLM that can rapidly adjust its modulation pattern in response to real-time sensing feedback. The system transitions from static, pre-programmed mask patterns to dynamic, adaptive spot shaping that responds to actual solder pool conditions, enabling continuous adjustment during the soldering process.
2Device complexity
If spot shape switching takes one second or more, then mask-based systems are simple in structure, but real-time adjustment of heating conditions cannot be performed
Solution Approach 1:
The patent replaces complex mechanical switching systems with an electronically controlled spatial light modulator. While the SLM adds optical complexity, it eliminates mechanical moving parts and enables real-time control through electrical signals, achieving both structural simplification (no mechanical actuators) and functional enhancement (real-time adjustment capability).
Solution Approach 2:
The system implements self-service control by using sensors to automatically detect solder pool temperature and shape, then the control unit automatically adjusts the SLM parameters without manual intervention. This closed-loop system performs real-time optimization of heating conditions based on actual process state, eliminating the need for external control inputs.
3Device complexity
If fixed spot shape and size are used in conventional laser soldering, then the optical system is simple, but heating conditions cannot be adjusted according to molten state of solder
Solution Approach 1:
The patent transforms the static optical system into a dynamic one where the SLM continuously adjusts spot shape and intensity distribution based on real-time solder pool conditions. This enables the heating conditions to adapt to the molten state of solder, improving manufacturing precision through active feedback control while maintaining relatively simple optical hardware.
Solution Approach 2:
The patent implements real-time parameter changes by controlling the SLM to modify spot shape, size, and intensity distribution according to solder pool temperature and morphology. The control unit adjusts optical parameters dynamically based on sensor feedback, enabling precise control of heating conditions to achieve high-quality soldering results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-quality soldering by allowing for rapid adjustment of laser irradiation conditions, preventing issues like the Manhattan phenomenon, improving solder distribution, and enhancing productivity in soldering processes, including three-dimensional mounting and simultaneous heating of multiple components.
Implementation Method 1
a spatial light modulator (SLM) that modulates the laser light incident from the laser light source
Implementation Method 2
a laser light source that emits laser light
Implementation Method 3
irradiates at least one of a solder or a soldering target object with the laser light
Implementation Method 4
The sensor may be an image sensor and may sense at least one of a position, a shape, or a color of the solder or the soldering target object
Implementation Method 5
The sensor may be a temperature sensor and may sense a temperature of the solder or the soldering target object
Implementation Method 6
The sensor may be a photodetector and may sense the spot of the laser light
Implementation Method 7
Laser soldering apparatuses that melt solder and perform soldering by laser light irradiation
Data Source
AI summary
To provide a laser soldering apparatus, a control apparatus, and a laser soldering method that are capable of performing high-quality soldering by laser irradiation. A laser soldering apparatus according to the present technology includes a laser light source, a spatial light modulator (SLM), and a control unit. The laser light source emits laser light. The SLM modulates the laser light incident from the laser light source and irradiates at least one of a solder or a soldering target object with the laser light. The control unit controls the laser light source and the SLM to adjust an irradiation condition of the laser light.