Laser Source PCB Layout for Compact Projection Modules
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Solution Overview
Problem
The existing laser projection apparatuses face challenges in miniaturization due to the large volume of the laser source, which is attributed to the packaging manner of the light-emitting chips and connecting circuit boards, hindering the reduction of size and increasing costs while compromising optical efficiency.
Innovation Solution
A laser source and projection apparatus design featuring a laser assembly with a mounting substrate having discontinuously distributed regions connected through internal wiring, where the light-emitting group is electrically connected to a conductive connecting portion that links to a second printed circuit board, allowing for a compact configuration without the need for a side plate to fix the connecting portion, thus reducing the overall volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the light-emitting chips are packaged with connecting circuit boards using traditional methods, then the electrical connection is reliable, but the volume of the laser source increases
Solution Approach 1:
The patent merges the first printed circuit board and second printed circuit board into a single integrated mounting substrate. The mounting substrate integrates the light-emitting chip mounting area, conductive connecting portions, and internal wiring structures into one unified component, eliminating the need for separate connecting circuit boards and reducing overall volume while maintaining electrical connection reliability
Solution Approach 2:
The patent implements a nested structure where the conductive connecting portion is embedded within the mounting substrate. The internal wiring is nested within the substrate layers, and the light-emitting chips are mounted on the substrate surface, creating a compact nested arrangement that reduces the lateral footprint and volume of the laser source
2Volume of moving object
If the laser source is miniaturized, then the portability improves, but the optical efficiency may be compromised
Solution Approach 1:
The patent transitions from a traditional lateral connection layout to a vertical three-dimensional arrangement. The light-emitting chips are mounted on the upper surface of the mounting substrate, with conductive connecting portions extending vertically through the substrate to connect with the second printed circuit board. This vertical stacking in the Z-dimension reduces the X-Y footprint while maintaining adequate electrical connection lengths, thereby preserving optical efficiency in a miniaturized form factor
3Volume of moving object
If the conductive connecting portion is fixed with a side plate, then the connection stability is improved, but the volume increases
Solution Approach 1:
The patent combines the fixing function and electrical connection function into the mounting substrate itself. The substrate serves as both the structural support that stabilizes the light-emitting chips and the conductive pathway for electrical connections. This integration eliminates the need for separate side plates while maintaining connection stability through the substrate's inherent mechanical and electrical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the miniaturization of the laser projection apparatus, improving portability and reducing the volume of the laser source while maintaining efficient optical performance.
Implementation Method 1
The light-emitting group includes a plurality of light-emitting chips and is configured to emit laser beams
Implementation Method 2
The first region is connected with the second region through an internal wiring of the mounting substrate
Data Source
AI summary
A laser source and a laser projection apparatus are provided. The laser source includes a laser assembly. The laser assembly includes a mounting substrate, a light-emitting group, and a conductive connecting portion. The mounting substrate is a first printed circuit board and includes a first surface, a first region, and a second region. The first region and the second region are discontinuously distributed, and the first region is connected with the second region through an internal wiring of the mounting substrate. The light-emitting group is electrically connected with the first region. A first end of the conductive connecting portion is connected with the second region, and a second end of the conductive connecting portion is configured to be electrically connected with a second printed circuit board, so as to electrically connect the light-emitting group with the second printed circuit board.