Laser Projection Light Source Sealing Without Chip Heat Damage
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Solution Overview
Problem
The existing manufacturing methods for laser projection apparatuses face challenges in ensuring the reliability and longevity of light-emitting chips due to thermal damage during the soldering process, which affects the overall performance and lifespan of the laser.
Innovation Solution
The laser projection apparatus employs a metal ring structure and a metal cover plate connected through local heating welding, avoiding the need for high-temperature furnaces and improving the sealing and stability of the connection between components, thus reducing thermal stress on the light-emitting chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering process is used to connect components, then manufacturing reliability is improved, but light-emitting chips suffer thermal damage reducing their lifespan
Solution Approach 1:
The patent divides the connection process into two separate stages: first, the metal ring structure is welded to the frame using traditional soldering; second, the metal cover plate is connected to the metal ring structure using a different welding method. This segmentation allows each connection to be optimized independently, protecting the light-emitting chips from excessive thermal exposure while ensuring reliable connections.
Solution Approach 2:
The metal ring structure serves as an intermediary component between the frame and the metal cover plate. It provides a thermal buffer that isolates the light-emitting chips from the high temperatures of the welding process, allowing reliable connections to be made without directly exposing the chips to damaging heat.
2Strength
If high-temperature furnace is used for soldering, then connection strength is improved, but thermal stress on light-emitting chips increases causing damage
Solution Approach 1:
The patent applies different thermal processing conditions to different parts of the assembly. The metal ring structure undergoes high-temperature soldering to achieve strong connections, while the light-emitting chips are protected from these temperatures. The metal cover plate is then attached using a controlled welding process that ensures connection strength without exposing the chips to excessive thermal stress.
Solution Approach 2:
The metal ring structure is first welded to the frame before the light-emitting chips are installed or before the final assembly is completed. This preliminary action allows the high-temperature soldering to be performed on metal components only, creating strong connections without exposing the light-emitting chips to thermal damage.
3Ease of manufacture
If traditional sealing method is used, then manufacturing simplicity is maintained, but sealing reliability deteriorates due to thermal damage to chips
Solution Approach 1:
The metal ring structure acts as a mediator that enables reliable sealing without requiring high-temperature processing of the entire assembly. It provides a thermal barrier that allows the sealing process to be performed on metal components only, ensuring sealing reliability while protecting the light-emitting chips from thermal damage.
Solution Approach 2:
The patent uses a metal cover plate with a structure that mirrors or copies the sealing interface requirements of the original design. This allows the sealing function to be replicated through a different material (metal instead of potentially heat-sensitive materials) that can withstand the welding process, thereby maintaining manufacturing simplicity while improving sealing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and longevity of the laser by preventing thermal damage to the light-emitting chips and improving the sealing and stability of the connection, leading to better heat dissipation and a more reliable illumination beam.
Implementation Method 1
The metal ring structure is configured to be fixed to the frame, so as to fixedly connect the frame with the metal cover plate in a welding manner of local heating
Implementation Method 2
The plurality of light-emitting chips are disposed in the accommodating space and configured to emit laser light
Data Source
AI summary
Provided is a laser projection apparatus. The laser projection apparatus includes a light source assembly, a light-modulating assembly, and a projection lens. The light source assembly includes a base plate, a frame, a plurality of light-emitting chips, a metal ring structure, a metal cover plate, and a light-transmitting layer. The frame is disposed on the base plate, and an accommodating space is defined between the base plate and the frame, and a material of the frame is ceramic. The plurality of light-emitting chips are disposed in the accommodating space and configured to emit laser light. The metal ring structure is configured to be fixed to the frame. An outer edge of the metal cover plate is fixed to one side of the metal ring structure distal from the base plate. An edge of the light-transmitting layer is fixed to an inner edge of the metal cover plate.