Semiconductor Laser Stem Layout for Shorter Heat Dissipation Paths
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Solution Overview
Problem
Semiconductor laser devices face challenges in maintaining constant temperature characteristics across a wide temperature range due to inefficient heat dissipation, especially when high light output is required, as the CAN package-type stem configuration hinders effective heat discharge.
Innovation Solution
A semiconductor laser device design featuring a thermoelectric element offset from the stem center, combined with a heat dissipation block having multiple portions that increase contact area and shorten heat dissipation paths, including lead pins around the heat dissipation block to enhance thermal conductivity and reduce insulator interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a CAN package using a stem is applied to reduce cost, then manufacturing cost is reduced, but heat dissipation becomes difficult due to the stem shape
Solution Approach 1:
The heat dissipation block extends in multiple spatial dimensions (length, width, height) to create extensive contact surfaces with the stem. The block's multi-portion structure utilizes three-dimensional space efficiently, maximizing contact area without increasing overall package size, thereby improving heat dissipation while maintaining the compact CAN package format.
Solution Approach 2:
The heat dissipation block is made of a material with higher thermal conductivity than the stem material. This composite approach combines the stem's structural advantages with the heat dissipation block's superior thermal properties, allowing efficient heat transfer from the stem to the block and then to the surrounding environment.
2Productivity
If high light output is requested to increase productivity, then light output is improved, but heat generation increases making temperature control more difficult
Solution Approach 1:
The heat dissipation block serves as a thermal intermediary between the heat-generating semiconductor laser and the external environment. It provides a low-thermal-resistance pathway for heat to flow from the laser through the block to the surroundings, enabling high light output while maintaining temperature control through enhanced heat evacuation.
3Shape
If the thermoelectric element is positioned at the center of the stem, then structural symmetry is maintained, but heat dissipation path length increases
Solution Approach 1:
The heat dissipation block is positioned asymmetrically relative to the stem center, optimized to maximize contact area and minimize heat dissipation path length. This asymmetric placement allows the block to extend toward regions of the stem that are most effective for heat evacuation, improving thermal performance while the overall device maintains functional symmetry through the offset configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves improved heat dissipation characteristics by securing a larger contact area and reducing heat resistance, allowing for efficient heat transfer and maintaining temperature stability across varying environmental conditions.
Implementation Method 1
a thermoelectric element provided at a position shifted to one side from a center of the stem, on an upper surface of the stem; a semiconductor laser configured to be temperature-controlled by the thermoelectric element
Implementation Method 2
a heat dissipation block including a first portion, a second portion, and a third portion... the heat dissipation path from the thermoelectric element to the side surface of the stem can be shortened
Data Source
AI summary
A semiconductor laser device includes a stem; a thermoelectric element provided at a position shifted to one side from a center of the stem, on an upper surface of the stem; a semiconductor laser configured to be temperature-controlled by the thermoelectric element; a heat dissipation block including a first portion, a second portion, and a third portion, the first portion being at least partially provided on a rear surface on a side opposite to the upper surface of the stem, the second portion being provided on the rear surface of the stem and extending from the first portion to just below the thermoelectric element, the third portion being provided on the one side on a side surface of the stem; and a plurality of lead pins provided around the second portion and penetrating through the stem from the upper surface to the rear surface.