Semiconductor Laser Package Step Wiring for Compact Bonding Layout
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Solution Overview
Problem
Existing light emitting devices with multiple semiconductor laser elements face challenges in achieving a suitable and efficient wiring pattern due to the increased size of the bonding region, which affects the device's compactness and performance.
Innovation Solution
A light emitting device design that includes a frame part surrounding the semiconductor laser elements, a light-reflective member, a step part, metal films, wires, and protective elements, where the wires electrically connect the semiconductor laser elements to the metal films, and the protective elements are disposed on the step part to facilitate efficient wiring and reduce the size of the bonding region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If one cavity is provided for each light emitting element, then each light emitting element can be properly housed and connected, but the size of the bonding region increases proportionally to the number of light emitting elements
Solution Approach 1:
The patent divides the bonding region into multiple levels using step portions. The first bonding region is located at a first level on the first surface of the substrate, while the second bonding region is located at a second level on the second surface of the substrate. This segmentation allows wiring to be distributed across different levels, reducing the area required at each level and preventing the bonding region size from increasing proportionally with the number of light emitting elements.
2Device complexity
If multiple light emitting elements are disposed at one surface, then the device structure is simplified, but achieving a suitable wiring pattern becomes difficult
Solution Approach 1:
The patent transitions from a two-dimensional wiring arrangement to a three-dimensional arrangement by utilizing step portions that create different levels on the substrate. The first wiring pattern connects light emitting elements to the first bonding region at the first level, while the second wiring pattern connects to the second bonding region at the second level. This dimensional change enables efficient wiring patterns for multiple light emitting elements disposed on one surface without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact and efficient wiring pattern, allowing for effective electrical connection of multiple semiconductor laser elements while minimizing the size of the bonding region, thereby enhancing the device's performance and compactness.
Implementation Method 1
The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part, and configured to reflect laser light traveling from the plurality of semiconductor laser elements toward one of the first inner lateral surfaces of the frame part
Data Source
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AI summary
A light emitting device includes semiconductor laser elements, a frame part, a light-reflective member, a step part, metal films, wires, and a first protective element. The frame part surrounds a bottom surface on which the semiconductor laser elements are disposed. The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part. The step part is formed along a second inner lateral surface of the frame part, and disposed inside of the frame. The metal films are provided on an upper surface of the step part. The wires electrically connect the semiconductor laser elements respectively to the metal films. The first protective element is disposed on the upper surface of the step part and on a light traveling side of the laser light with respect to a plane including an emitting end surface of the first semiconductor laser element.