Laser Stripping Mass-Transfer Device for Microdevices
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Solution Overview
Problem
The existing chip-transfer technologies for micro-LED display panel manufacturing are inefficient and unable to meet the requirements of mass-transfer of microdevices, leading to high production costs and low efficiency.
Innovation Solution
A laser stripping mass-transfer device and method utilizing a winding process, incorporating modules such as microdevice stripping transfer, auxiliary conveyor, transition conveyor, transfer conveyor, substrate carrier, microdevice filling, curing, encapsulation, and substrate transportation, which leverage laser stripping technology to improve production efficiency and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional robotic arm chip transfer technology is used, then individual chip transfer can be achieved, but production efficiency is too low for mass transfer requirements
Solution Approach 1:
The transfer system is segmented into multiple functional modules: laser stripping module, first conveyor module, second conveyor module, and third conveyor module. Each module performs a specific function in the mass transfer process, enabling high-throughput operation while maintaining manageable system complexity through modular design.
Solution Approach 2:
The traditional mechanical robotic arm picking and placing system is replaced with a laser-based stripping system combined with conveyor modules. The laser stripping module uses optical energy to separate chips from the substrate, eliminating the need for mechanical grasping and positioning, thereby dramatically increasing transfer speed and efficiency.
2Productivity
If conventional chip transfer methods are used, then chip transfer can be performed, but production cost remains high due to low efficiency
Solution Approach 1:
The system implements continuous chip transfer through interconnected conveyor modules that operate simultaneously. While the laser stripping module processes chips from one substrate, the first conveyor module transports processed chips, and the second conveyor module prepares the next substrate, eliminating idle time and achieving continuous production flow that reduces per-unit cost.
Solution Approach 2:
The laser stripping module performs preliminary chip separation from the substrate before the chips are transferred to the destination. This preliminary action prepares the chips for immediate placement without requiring additional handling steps, streamlining the overall process and reducing production time and cost.
3Productivity
If laser stripping technology is integrated with winding process, then production efficiency is improved, but device structure becomes more complex
Solution Approach 1:
The conveyor modules are designed with multi-functionality, serving both as transport mechanisms and as integration platforms for the laser stripping system. The same conveyor structure that moves chips also supports the laser positioning and stripping operations, eliminating the need for separate dedicated structures and reducing overall system complexity despite the advanced functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively integrates laser stripping technology with the winding process to enhance production efficiency and reduce costs by ensuring precise and efficient transfer of microdevices, achieving equal-interval arrangement and compensating for uneven distributions, thus improving the overall manufacturing process.
Implementation Method 1
a laser scan movement unit configured to move the transfer laser scan unit and the transfer laser stripping unit; a transfer laser scan unit configured to weaken the bonding strength between microdevices and a wafer plate
Implementation Method 2
an auxiliary conveyor module configured to adhere the stripped microdevices, evenly arrange the stripped microdevices, and then transfer the stripped microdevices onto the transition conveyor module
Data Source
AI summary
A laser stripping mass-transfer device includes a microdevice laser stripping transfer module, an auxiliary conveyor module, a transition conveyor module, a transfer conveyor module, a substrate carrier module, a microdevice filling module, a curing module, an encapsulation module and a substrate transportation module. The microdevice laser stripping transfer module is configured to implement detection and stripping of the microdevices. The auxiliary conveyor module is configured to adhere the stripped microdevices. The transition conveyor module is configured to pick up and transfer the microdevices to the transfer conveyor module. The transfer conveyor module is configured to pick up and transfer the microdevices to the substrate carrier module. The substrate carrier module is configured to feed the microdevices into the microdevice filling module, the curing module, the encapsulation module, and the substrate transportation module for filling, curing, encapsulating, loading and unloading.