Semiconductor Laser Sub-Mount with Extended Thermal Stress Reliever
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Solution Overview
Problem
Conventional semiconductor laser machines face challenges in preventing short circuit failures and achieving efficient heat dissipation due to the reduced volume of the sub-mount, which limits heat propagation from the semiconductor laser element to the heat sink.
Innovation Solution
The semiconductor laser machine incorporates a sub-mount with a substrate that extends rearwardly from the semiconductor laser element, featuring a solder layer and junction layer configuration where the solder layer is removed behind the second end face, preventing solder material from climbing the semiconductor laser element and allowing for efficient heat diffusion to the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sub-mount length is reduced to prevent solder material from climbing the semiconductor laser element, then short circuit prevention is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent applies local quality by creating different structural characteristics in different regions of the sub-mount. The front portion (near the semiconductor laser element) has a shorter length to prevent solder climbing, while the rear portion extends backward to provide sufficient heat dissipation volume. This spatial differentiation of structural properties resolves the contradiction between short circuit prevention and heat dissipation efficiency.
2Manufacturing precision
If the sub-mount volume is reduced to prevent solder material climbing, then manufacturing precision is improved, but heat propagation efficiency deteriorates
Solution Approach 1:
The patent resolves the volume constraint by extending the sub-mount in the backward direction (another dimension relative to the semiconductor laser element mounting face). This dimensional extension provides sufficient volume for heat propagation without increasing the forward footprint that would cause solder material to climb the semiconductor laser element, thus maintaining manufacturing precision while improving heat propagation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents short circuit failures and enhances heat dissipation, reducing strain on the semiconductor laser element and extending its lifetime by promoting efficient heat transfer from the semiconductor laser element to the heat sink.
Implementation Method 1
The thermal stress results from a difference between respective thermal expansion coefficients of the semiconductor laser element and the heat sink
Implementation Method 2
less heat that propagates from the semiconductor laser element to the heat sink diffuses in the sub-mount
Data Source
AI summary
A semiconductor laser machine includes a semiconductor laser element including a first end face that emits a laser beam and a second end face that is opposite the first end face; a heat sink; and a sub-mount securing the semiconductor laser element to the heat sink. The sub-mount includes a substrate that serves as a thermal stress reliever, a solder layer joined to the semiconductor laser element, and a junction layer formed between the substrate and the solder layer. Compared with the semiconductor laser element, the substrate is extended in a rearward direction that is from the first end face toward the second end face. As for the solder layer and the junction layer, a portion of at least the solder layer is removed behind the second end face.