Semiconductor Laser Element Sub-Pattern Data Encoding
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Solution Overview
Problem
Semiconductor laser elements with small sizes pose a challenge in forming patterns that can accommodate sufficient information, limiting the amount of data that can be attached due to size constraints.
Innovation Solution
The semiconductor laser element features a substrate with a semiconductor layered body and sub-patterns formed by dividing an integrated pattern on one or both main surfaces, allowing for the combination of these sub-patterns to read predetermined information, enabling the attachment of a larger amount of data to smaller elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a single integrated pattern is formed on the semiconductor laser element, then the information can be read directly, but the element size becomes too large
Solution Approach 1:
The integrated pattern is divided into multiple sub-patterns that are distributed across different regions of the semiconductor laser element. Each sub-pattern contains a portion of the information, and when combined, they reconstruct the complete information. This segmentation allows the information capacity to be increased without requiring a single large pattern area.
2Area of moving object
If the pattern size is reduced to fit small elements, then the element size is reduced, but the amount of information that can be attached is limited
Solution Approach 1:
Instead of increasing information capacity by enlarging a single pattern in two dimensions, the solution transitions to a multi-dimensional approach by distributing sub-patterns across multiple locations and layers of the element. The information is reconstructed by combining these spatially separated sub-patterns, effectively adding a spatial distribution dimension to the information storage system.
Data Source
AI summary
A semiconductor laser element includes a substrate having a first main surface and a second main surface; a semiconductor layered body including an active layer, the semiconductor layered body being disposed on the first main surface; and a plurality of sub-patterns that, when combined, form an integrated pattern that allows reading of predetermined information, the plurality of sub-patterns being disposed on either one or both a first main surface side and a second main surface side of the substrate.