Semiconductor Laser Submount Layout for Compact Protective Element Spacing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting devices require larger mounting regions due to the close proximity of semiconductor laser elements and protective elements, which limits the density of component placement and increases the size of the device.
Innovation Solution
A light-emitting device design featuring a submount with a wiring pattern that includes a first region for the semiconductor laser element and a second region for the protective element, where the semiconductor laser element is disposed in the first region and the protective element is disposed in the second region, with a controlled width and length configuration to minimize the mounting area, and an interval between the elements is maintained between 0 μm and 170 μm to reduce the overall mounting region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the semiconductor laser element and protective element are disposed closer to each other, then the mounting region can be reduced, but the stability and reliability may be compromised due to potential unintended contact
Solution Approach 1:
The wiring pattern is divided into a first region for the semiconductor laser element and a second region for the protective element, with distinct width specifications for each region. This segmentation allows optimized spacing and reduced mounting area while maintaining reliable electrical connections and preventing unintended contact between elements
Solution Approach 2:
The patent specifies precise parameter ranges: the width of the first region is greater than the width of the semiconductor laser element but equal to or less than a first distance, and the interval between elements is greater than 0 μm and less than 170 μm. These parameter optimizations enable compact mounting while ensuring stability
2Area of stationary object
If the width of the first region is increased to accommodate the semiconductor laser element, then the mounting region increases, but the ease of manufacture and precision of component placement is improved
Solution Approach 1:
The wiring pattern has different width characteristics in different regions: the first region has a width greater than the semiconductor laser element width to facilitate easy placement, while the overall mounting region is minimized through optimized dimensions. This local quality differentiation resolves the contradiction between compact size and manufacturing ease
Data Source
AI summary
A light-emitting device includes a submount, a semiconductor laser element, and a protective element. The submount includes a wiring pattern. The wiring pattern includes first and second regions connected at a first position. The semiconductor laser element is disposed on the first region. The protective element is disposed on the second region. The width of the first region is greater than a width of the semiconductor laser element in the first direction. The length of the first region in a second direction between the first position and a distal end of the first region is a second distance. A maximum width of the second region is greater than the width of the first region in the first direction at the first position. An interval in the second direction between the semiconductor laser element and the protective element is greater than 0 μm and less than 170 μm.