Semiconductor Laser Sub-Mount Wiring for Individual Degradation Inspection
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Solution Overview
Problem
Existing light emitting devices with semiconductor laser elements connected in series face challenges in accurately detecting minute degradation of individual elements during inspection, as collective inspection methods fail to identify subtle changes in electrical or optical properties due to improper mounting or heat dissipation issues.
Innovation Solution
A method involving a light emitting device with a base having multiple wirings that allows for individual inspection of semiconductor laser elements by performing measurements before and after prolonged current supply, enabling evaluation of each element's properties and ensuring high reliability by detecting subtle changes in electrical and optical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor laser elements are inspected collectively after mounting and connection, then inspection efficiency is improved, but accurate detection of minute degradation of individual elements becomes difficult
Solution Approach 1:
The patent applies segmentation by providing separate wiring paths (first wiring, second wiring, third wiring) that enable individual electrical connection and inspection of each semiconductor laser element (first element and second element) even when they are mounted together on the same base. This allows the inspection system to segment the measurement process into individual element assessments while maintaining the collective mounting structure.
2Measurement precision
If semiconductor laser elements are inspected individually before mounting, then accurate detection of element properties is improved, but results reflecting the mounted state cannot be obtained
Solution Approach 1:
The patent applies preliminary action by establishing the wiring structure (first wiring, second wiring, third wiring) and electrical connection paths before the actual inspection process. This pre-configured wiring system enables both individual element inspection and mounted state evaluation to be performed seamlessly, allowing properties measured before mounting to be directly correlated with performance after mounting.
Data Source
AI summary
A light emitting device includes: a plurality of sub-mounts including at least a first sub-mount and a second sub-mount; a plurality of semiconductor laser elements including a first semiconductor laser element mounted on the first sub-mount and a second semiconductor laser element mounted on the second sub-mount; a plurality of protective elements including a first protective element mounted on the first sub-mount and a second protective element mounted on the second sub-mount; and a plurality of wires including a first wire, wherein a first end of the first wire is joined to the first protective element and a second end of the first wire is joined to the second sub-mount, and wherein the first wire overlaps a portion of the first semiconductor laser element in a top view.